We propose a high-frequency scalable electrical model of a through silicon via (TSV). The proposed model includes not only the TSV, but also the bump and the redistribution layer (RDL), which are ...additional components when using TSVs for 3-D integrated circuit (IC) design. The proposed model is developed with analytic RLGC equations derived from the physical configuration. Each analytic equation is proposed as a function of design parameters of the TSV, bump, and RDL, and is therefore, scalable. The scalability of the proposed model is verified by simulation from the 3-D field solver with parameter variations, such as TSV diameter, pitch between TSVs, and TSV height. The proposed model is experimentally validated through measurements up to 20 GHz with fabricated test vehicles of a TSV channel, which includes TSVs, bumps, and RDLs. Based on the proposed scalable model, we analyze the electrical behaviors of a TSV channel with design parameter variations in the frequency domain. According to the frequency-domain analysis, the capacitive effect of a TSV is dominant under 2 GHz. On the other hand, as frequency increases over 2 GHz, the inductive effect from the RDLs becomes significant. The frequency dependent loss of a TSV channel, which is capacitive and resistive, is also analyzed in the time domain by eye-diagram measurements. Due to the frequency dependent loss, the voltage and timing margins decrease as the data rate increases.
Proper power integrity (PI) analysis is required for printed circuit board (PCB) power distribution network (PDN) design. Top-layer interconnect inductance for PI has always been a vital concern for ...high-speed industry. Developing a simple physics-based equivalent circuit model for critical structures is essential for understanding the physics of the system and for intelligent designs. In this paper, a physics-based model size reduction (PMSR) method is applied to get the equivalent circuit model for the above-ground geometries. The extracted physics-based models are also based on the partial element equivalent circuit (PEEC) method, and can be used in analyzing the structure in its parts. By applying PMSR method, a physics-based equivalent circuit model can be proposed and this circuit model is related to the geometric features of the design. In this way, PMSR method can provide an intuitive guideline in designing PCB and reducing above inductances, therefore, a low-ripple dc voltage can be delivered through PDN. Taking advantage of PEEC and PMSR methods, the top-layer inductances of three different geometries are calculated and the physics-based circuit models are obtained, respectively.
Novel de-embedding launch geometries and a simplified analytical procedure are proposed to extract the exact electromagnetic behavior of a through silicon via (TSV) pair from measured data. First, ...the most recent de-embedding method is reviewed and it is deeply investigated using both 3-D simulation and vector network analyzer measurements to accurately evaluate its residual error. Then, some potential sources of error are hypothesized and overcome by the proposed launch geometries based on a de-embedding plane that is able to ensure a TEM (or quasi-TEM) mode propagation. The novel launches are studied through 3-D simulations; the previous de-embedding procedure is updated to consider the fringing effect of the open-end launch, and it is simplified reducing the launch standards from three to two. The proposed launch geometries and algorithm are shown to be more accurate in the TSV pair de-embedding with respect to the method currently employed.
In three-dimensional integrated circuit (3D-IC) systems that use through-silicon via (TSV) technology, a significant design consideration is the coupling noise to or from a TSV. It is important to ...estimate the TSV noise transfer function and manage the noise-tolerance budget in the design of a reliable 3D-IC system. In this paper, a TSV noise coupling model is proposed based on a three-dimensional transmission line matrix method (3D-TLM). Using the proposed TSV noise coupling model, the noise transfer functions from TSV to TSV and TSV to the active circuit can be precisely estimated in complicated 3D structures, including TSVs, active circuits, and shielding structures such as guard rings. To validate the proposed model, a test vehicle was fabricated using the Hynix via-last TSV process. The proposed model was successfully verified by frequency- and time-domain measurements. Additionally, a noise isolation technique in 3D-IC using a guard ring structure is proposed. The proposed noise isolation technique was also experimentally demonstrated; it provided -17 dB and -10dB of noise isolation between the TSV and an active circuit at 100 MHz and 1 GHz, respectively.
An analytic scalable model of a differential signal through-silicon via (TSV) is proposed. This TSV is a ground-signal-signal-ground (GSSG)-type differential signal TSV. Each proposed analytical ...equation in the model is a function of the structural and material design parameters of the TSV and the bump, which is scalable. The proposed model is successfully validated with measurements up to 20 GHz for the fabricated test vehicles. Additionally, the scalability of the proposed model is verified with simulations by using Ansoft HFSS to vary the design parameters, such as the TSV diameter, pitch between TSVs, and TSV oxide thickness. On the basis of the proposed scalable model, the electrical behaviors of the GSSG-type differential signal TSV are analyzed with respect to the design variations in the frequency domain. Additionally, the electrical performances of a GSSG-type differential signal TSV are evaluated and compared to that of a ground-signal-ground-type single-ended signal TSV, such as insertion loss, characteristic impedance, voltage/timing margin, and noise immunity.
This paper describes a method to suppress the leakage magnetic field from a wireless power transfer (WPT) system through the use of a ferrimagnetic material and metallic shielding. To demonstrate the ...advantages of the coil structure with the ferrimagnetic material and metallic shielding, magnetic field distributions and the electrical performance of three different coil structures are investigated via 3D electromagnetic (EM) field solver and SPICE simulation. Results show that the suggested method considerably reduces the leakage magnetic field in the vicinity of the WPT system without significant loss of electrical performance. The simulation results of the suggested coil structure are experimentally verified with a 100 W-class WPT system for an LED TV.
This paper presents an analysis of the electromagnetic interference of a heterogeneous power bus where electromagnetic bandgap (EBG) cells are irregularly arranged. To mitigate electrical-noise ...coupling between high-speed circuits, the EBG structure is placed between parallel plate waveguide (PPW)-based power buses on which the noise source and victim circuits are mounted. We examine a noise suppression characteristic of the heterogeneous power bus in terms of scattering parameters. The characteristics of the dispersion and scattering parameters are compared in the sensitivity analysis of the EBG structure. Electric field distributions at significant frequencies are thoroughly examined using electromagnetic simulation based on a finite element method (FEM). The noise suppression characteristics of the heterogeneous power bus are demonstrated experimentally. The heterogeneous power bus achieves significant reduction of electrical-noise coupling compared to the homogeneous power buses that are adopted in conventional high-speed circuit design. In addition, the measurements show good agreement with the FEM simulation results.
This paper presents an analysis of the electromagnetic interference of a heterogeneous power bus where electromagnetic bandgap (EBG) cells are irregularly arranged. To mitigate electrical-noise ...coupling between high-speed circuits, the EBG structure is placed between parallel plate waveguide (PPW)-based power buses on which the noise source and victim circuits are mounted. We examine a noise suppression characteristic of the heterogeneous power bus in terms of scattering parameters. The characteristics of the dispersion and scattering parameters are compared in the sensitivity analysis of the EBG structure. Electric field distributions at significant frequencies are thoroughly examined using electromagnetic simulation based on a finite element method (FEM). The noise suppression characteristics of the heterogeneous power bus are demonstrated experimentally. The heterogeneous power bus achieves significant reduction of electrical-noise coupling compared to the homogeneous power buses that are adopted in conventional high-speed circuit design. In addition, the measurements show good agreement with the FEM simulation results. KCI Citation Count: 0
In this paper, we propose glass interposer electromagnetic bandgap (EBG) structure to efficiently suppress power/ground noise coupling. We designed, fabricated, measured, and analyzed a glass ...interposer EBG structure for the first time. Glass interposer EBG structure test vehicles were fabricated using a thin-glass substrate, low-loss polymer layers, and periodic metal patches with through glass vias (TGVs) in glass interposer power distribution network. Using the dispersion characteristics, we thoroughly analyzed and derived f L and f U of the glass interposer EBG structure. We experimentally verified that the proposed glass interposer EBG structure achieved power/ground noise suppression (below -40 dB) between f L of 5.8 GHz and f U of 9.6 GHz. Derived f L and f U based on dispersion analysis, full three-dimensional electromagnetic (3-D-EM) simulation and measurement achieved good correlation. In the glass interposer EBG structure, tapered structure of the TGV and thickness of the low-loss polymer used for metal-layers lamination affected the noise suppression bandgap significantly. The effectiveness of the proposed glass interposer EBG structure on suppression of the power/ground noise propagation and coupling to high-speed TGV channel was verified with 3-D-EM simulation. As a result, the proposed glass interposer EBG structure successfully and efficiently suppressed the power/ground noise propagation and improved eye-diagram of the high-speed TGV channel.
In this paper, we measured and analyzed glass interposer power distribution network (PDN) resonance effects on a high-speed through glass via (TGV) channel for the first time. To verify the glass ...interposer PDN resonance effects on the TGV channel, glass interposer test vehicles were fabricated. With these test vehicles, glass interposer PDN impedance, channel loss, far-end crosstalk, and eye diagram are measured. Based on these measurements, glass interposer PDN resonance effects on the signal integrity of the high-speed TGV channel are analyzed. Due to low loss of the glass substrate, sharp high PDN impedance peaks are generated at the resonance frequencies. High PDN impedance peaks at the PDN resonance frequencies, which affect return current of the TGV channel, increase channel loss, crosstalks, and PDN noise coupling in the frequency domain and degrade eye diagram in the time domain. To suppress these glass interposer PDN resonance effects, a ground shielded-TGV scheme is proposed. The proposed ground shielded-TGV scheme includes two ground TGVs 200 μm away from the signal TGV considering the design rules and includes package ground underneath the glass interposer. Effectiveness of the suggested grounding scheme on the resonance effects suppression is verified with three-dimensional electromagnetic simulation. The proposed shielded-TGV design successfully suppressed the glass interposer PDN resonance effects that results in the suppression of insertion loss, shielding of the crosstalk, and improvement of the eye diagram of the high-speed TGV channel.
