Coaxial through silicon via (TSV) technique allows reduction of high frequency loss due to conductivity in silicon substrate and flexibility in impedance by controlling the ratio of shield to center ...radii. For the first time, we measured and analyzed the high-speed channel performance of coaxial TSV. This letter presents the measurement results of the fabricated test vehicle in S-parameter and eye-diagram. The eye-diagram measurement results prove that coaxial TSV is capable of supporting signal transmission up to bit rate of 30 Gbps. The equivalent circuit model is suggested and experimentally verified by S-parameter comparison. Furthermore, the superiority of coaxial TSV over conventional TSV is confirmed by comparison of S-parameter results from equivalent circuit model simulation.
Current wireless power transfer (WPT) technology can only allow power transfer over a limited distance because, as the distance between the transmitter (Tx) and receiver (Rx) coils increases, the ...power transfer efficiency (PTE) decreases with a steep slope, while the electromagnetic field (EMF) leakage increases. In order to increase the PTE and decrease the EMF leakage simultaneously, we need to develop a method to concentrate the magnetic fields between the Tx and Rx coils. In this paper, we proposed a novel metamaterial structure to realize high efficiency and low EMF leakage. Metamaterials can confine the magnetic fields between the Tx and Rx coils by negative relative permeability. We designed and fabricated a thin metamaterial using a 1.6-mm dual layer printed circuit board (PCB) with a high dielectric constant substrate and a fine pattern to achieve a negative relative permeability with low loss at 6.78 MHz. The thin PCB-type metamaterial has a wide range of applications with low fabrication cost, light weight, and a simple fabrication process. We demonstrated a 44.2% improvement in the PTE and 3.49-dBm reduction in the EMF leakage around the WPT system at 20-cm distance. Furthermore, we first analyzed metamaterials from an EMF point of view using the 3-D magnetic field scanner. Finally, we discussed a combination of metamaterials and ferrites to further improve the PTE and reduce the EMF leakage for long-distance mobile WPT systems.
Wireless power transfer (WPT) technology is an electrically safe and convenient method of charging batteries. WPT technology allows elimination of exposed contacts, which can cause direct ...electrocution of human. In spite of the great advantages, the WPT system inevitably generates strong electromagnetic fields (EMFs), causing interference on the nearby electrical devices as well as harmful influence on human health. Therefore, it is important to satisfy EMF guidelines and reduce leakage magnetic field harmonics in WPT system. For the first time, in this paper, we propose a new tightly coupled handheld resonant magnetic field (HH-RMF) charger operating at 20 kHz with low EMF and high efficiency. Using a guided magnetic flux in resonance structure, 64.5 mG of EMF is reduced compared to the conventional inductive charger at a distance of 200 mm from edge of the core. In addition to the electromagnetic interference (EMI) reduction, the isolation inductor scheme is proposed as an EMI reduction method. Through a series of measurements, we experimentally verified that the proposed HH-RMF charger complies with the regulations published by the International Commission on Non-Ionizing Radiation Protection in 1998. The proposed HH-RMF charger with the isolation inductor scheme successfully reduces the third harmonic of the Tx and Rx currents by 23.4 and 11.8 dBμA, respectively. Furthermore, the third and fifth magnetic field harmonics reduce by 1.38 and 0.67 mG, respectively. The coil-to-coil power transfer efficiency and total system power transfer efficiency of the proposed structure are maintained at over 98% and 84%, respectively.
This paper, for the first time, proposes a novel stochastic model-based eye-diagram estimation method for 8B/10B and transition-minimized differential signaling (TMDS)-encoded high-speed channels. A ...stochastic model describes a behavior of an encoder with respect to probability. The previous eye-diagram estimation methods are based on an assumption that each bit has the same probability for 1 s and 0 s. However, the assumption limits to estimate an accurate eye-diagram for encoded high-speed channels. We first propose and apply the stochastic model for two types of 8B/10B encodings: 8B/10B and TMDS. For verification, we design the 8B/10B and TMDS encoder within MATLAB. The transient simulation for the 8B/10B encoded channels requires 9700 and 6600 s, respectively. However, the proposed method only requires 23 s in both cases. Furthermore, in the bit-error rate, the transient simulation provides the bathtub curve up to 10 -2 due to processing time and computing resources. In contrast, the proposed method with the stochastic model provides the bathtub curve up to 10 -8 . In conclusion, this paper successfully proposes and verifies the stochastic model-based eye-diagram estimation method for 8B/10B-encoded high-speed channels.
Through silicon via (TSV)-based 3-D integrated circuit has introduced the solution to limitlessly growing demand on high system bandwidth, low power consumption, and small form factor of electronic ...devices. As the system design aims for higher performance, the physical dimensions of the channels are continuously decreasing. With TSV diameter of less than 10 μm and pitch of several tens of micrometers, the I/O count has increased up to the order of tens of thousands for wide bandwidth data transmission. However, without highly precise fabrication process, such small structures are susceptible to a variety of defects. For the first time, in this paper, we propose a noninvasive defect analysis method for high-speed TSV channel. With designed and fabricated test vehicles, the proposed method is demonstrated with S-parameter and time-domain reflectometry measurement results. In addition, we present equivalent circuit models of TSV daisy-chain structures, including the circuit components for open defect and short defect. With characterized dominant factors in each frequency range, S 11 is analyzed to distinguish and locate the defects by the amount of capacitance, resistance, and inductance that the signal experiences. S-parameter measurement sufficiently allows high-frequency defect analysis of TSV channel without destroying the test sample. We experimentally verified the accuracy of the suggested model by comparing the S-parameter results from circuit simulations and measurements. Finally, the model is modified to discuss the effects of open defect and short defect on the electrical characteristics of TSV channel.
In this paper, we measured and analyzed glass interposer power distribution network (PDN) resonance effects on a high-speed through glass via (TGV) channel for the first time. To verify the glass ...interposer PDN resonance effects on the TGV channel, glass interposer test vehicles were fabricated. With these test vehicles, glass interposer PDN impedance, channel loss, far-end crosstalk, and eye diagram are measured. Based on these measurements, glass interposer PDN resonance effects on the signal integrity of the high-speed TGV channel are analyzed. Due to low loss of the glass substrate, sharp high PDN impedance peaks are generated at the resonance frequencies. High PDN impedance peaks at the PDN resonance frequencies, which affect return current of the TGV channel, increase channel loss, crosstalks, and PDN noise coupling in the frequency domain and degrade eye diagram in the time domain. To suppress these glass interposer PDN resonance effects, a ground shielded-TGV scheme is proposed. The proposed ground shielded-TGV scheme includes two ground TGVs 200 μm away from the signal TGV considering the design rules and includes package ground underneath the glass interposer. Effectiveness of the suggested grounding scheme on the resonance effects suppression is verified with three-dimensional electromagnetic simulation. The proposed shielded-TGV design successfully suppressed the glass interposer PDN resonance effects that results in the suppression of insertion loss, shielding of the crosstalk, and improvement of the eye diagram of the high-speed TGV channel.
In this paper, we proposed through silicon via (TSV) to active circuit noise coupling model based on 3-dimensional transmission line matrix method and analyzed the noise coupling paths. When a TSV is ...located near the active circuit, the noise can easily travel through various coupling paths. With the proposed model, the noise coupling coefficient between TSV and the active circuit in a 3D IC can be estimated precisely. The cross-coupled differential LC-VCO was analyzed as the target active circuit because it is one of the main components in RF applications. With the suggested model, the noise coupling effects from the various coupling paths were compared, and the most critical noise coupling path was determined. We verified the accuracy of the proposed model with full 3D EM simulation results. Additionally, we proposed shielding structures using a guard ring and the ground TSVs for suppression of the noise coupling in 3D IC. The proposed noise suppression methods can reduce the TSV noise by blocking the noise paths to the active circuit. Various shielding structures were evaluated by comparing the different phase noise of LC-VCO to analyze the shielding effectiveness.
In this paper, we propose glass interposer electromagnetic bandgap (EBG) structure to efficiently suppress power/ground noise coupling. We designed, fabricated, measured, and analyzed a glass ...interposer EBG structure for the first time. Glass interposer EBG structure test vehicles were fabricated using a thin-glass substrate, low-loss polymer layers, and periodic metal patches with through glass vias (TGVs) in glass interposer power distribution network. Using the dispersion characteristics, we thoroughly analyzed and derived f L and f U of the glass interposer EBG structure. We experimentally verified that the proposed glass interposer EBG structure achieved power/ground noise suppression (below -40 dB) between f L of 5.8 GHz and f U of 9.6 GHz. Derived f L and f U based on dispersion analysis, full three-dimensional electromagnetic (3-D-EM) simulation and measurement achieved good correlation. In the glass interposer EBG structure, tapered structure of the TGV and thickness of the low-loss polymer used for metal-layers lamination affected the noise suppression bandgap significantly. The effectiveness of the proposed glass interposer EBG structure on suppression of the power/ground noise propagation and coupling to high-speed TGV channel was verified with 3-D-EM simulation. As a result, the proposed glass interposer EBG structure successfully and efficiently suppressed the power/ground noise propagation and improved eye-diagram of the high-speed TGV channel.
Analog-to-digital converter (ADC) is becoming of utmost importance in an automotive environment. With the increased number of magnetic field sources near the ADC that can alter its behaviors ...significantly, we need to model how magnetic field affects the performance of the ADC. Therefore, in order to accurately evaluate the practical performance of the ADC and the considerable off-chip and on-chip effects that are highly complex, the chip-printed circuit board (PCB) comodeling, cosimulation, and coanalysis are required. In this study, a comodel of the magnetic field effects on an ADC is proposed. The proposed comodel includes three separate submodels: a model of the magnetic field coupling from the wireless power transfer (WPT) system input to the PCB integrated with ADC, a model of the noise coupling from the PCB to the ADC input, and a model of the ADC behavior from the ADC input to the ADC outputs. Considering the magnetic field coupling from the magnetic field source to the PCB, a new inductive transmission line model (I-TLM) method is developed. This method achieves fast, precise, and broadband estimation of the magnetic field effects in comparison to previous estimation methods. To validate the proposed comodel, an ADC is fabricated using a 0.13-μm complementary metal-oxide semiconductor process and is wire-bonded to the designed PCB for ADC. A PCB-level WPT system is designed and built as the magnetic field source. The performance factor of the ADC is measured by sweeping the WPT system input frequency from 100 kHz to 1 GHz to find out the critical WPT system frequency for the designed ADC with the chip-PCB hierarchical structure. The results estimated by the proposed model correlate well with the full 3-D electromagnetic field simulation and measurement. The proposed modeling procedure reduces the time and computation resource in the design of the chip, package, and PCB to achieve high-quality analog devices or mixed-mode systems, while also providing an intuitive understanding of the radiated noise effect.
This paper, for the first time, proposes and verifies a new coaxial silicone rubber socket for high-bandwidth and high-density package test using a fabricated sample. In addition, this paper also ...characterizes and verifies the coaxial silicone rubber socket. Because of the proposed coaxial socket's novel coaxial structure, the proposed socket successfully achieves the electrical performance improvement. For verification, we compare the proposed socket and the previous noncoaxial socket in time domain. The proposed socket has greater eye height and eye width in the measured eye diagram than those of the noncoaxial socket. Moreover, the slope in the eye diagram is also improved in the case of the proposed socket. Therefore, the measured eye diagram for the coaxial socket shows the improvement in electrical performances. This paper also characterizes the equivalent RLGC model for the coaxial silicone rubber socket. In order to verify the RLGC model, we compare the insertion losses and eye diagrams from measurement, 3-D electromagnetic simulation, and the proposed RLGC model, respectively. Their insertion losses are comparable up to 20 GHz. Furthermore, the obtained eye diagrams are almost identical at the data rate of 9.6 Gb/s. In conclusion, this paper successfully proposes, verifies, and characterizes a new coaxial silicone rubber socket for the first time.
