In this paper, we measured and analyzed glass interposer power distribution network (PDN) resonance effects on a high-speed through glass via (TGV) channel for the first time. To verify the glass ...interposer PDN resonance effects on the TGV channel, glass interposer test vehicles were fabricated. With these test vehicles, glass interposer PDN impedance, channel loss, far-end crosstalk, and eye diagram are measured. Based on these measurements, glass interposer PDN resonance effects on the signal integrity of the high-speed TGV channel are analyzed. Due to low loss of the glass substrate, sharp high PDN impedance peaks are generated at the resonance frequencies. High PDN impedance peaks at the PDN resonance frequencies, which affect return current of the TGV channel, increase channel loss, crosstalks, and PDN noise coupling in the frequency domain and degrade eye diagram in the time domain. To suppress these glass interposer PDN resonance effects, a ground shielded-TGV scheme is proposed. The proposed ground shielded-TGV scheme includes two ground TGVs 200 μm away from the signal TGV considering the design rules and includes package ground underneath the glass interposer. Effectiveness of the suggested grounding scheme on the resonance effects suppression is verified with three-dimensional electromagnetic simulation. The proposed shielded-TGV design successfully suppressed the glass interposer PDN resonance effects that results in the suppression of insertion loss, shielding of the crosstalk, and improvement of the eye diagram of the high-speed TGV channel.
The emergence of smartphones and other smart systems is driving new trends in electronics scaling that goes beyond transistors or active devices, to include all the system components such as ...packaging substrates, passive components, thermal structures, power sources, and the system interconnections. Current system components are at milliscale, creating a 10 3 to 10 6 scaling gap with the packaging interfaces at microscale, and transistors at nanodimensions. With current microstructured materials, component miniaturization also degrades performance metrics such as efficiency, tolerance or precision, thermal and frequency stability. Nanostructured materials and processes can potentially miniaturize these system components, while simultaneously enhancing the performance. These nanostructured components are assembled close to the active devices, resulting in ultraminiaturized and ultrathin systems with 3-D integration of passives with actives. This paper shows the impact of nanostructured materials toward enhancing the performance and miniaturization of power and radio-frequency (RF) passive components in emerging smart systems. Opportunities for nanostructured materials in improving the power density and efficiency of capacitors and inductors in power-supply modules are reviewed in the first part of the paper. The impact of nanostructured magnetic, dielectric and magneto-dielectric films on emerging RF subsystems is illustrated in the last part of the paper.
This paper presents the modeling, design, fabrication, and characterization of an innovative and miniaturized thinfilm bandpass filter with coupled spiral structures in ultrathin glass substrates ...(30-100 μm). This filter is demonstrated for two applications: 3-D integrated passive devices and embedded thinfilm filters in RF modules. A compact filter design was achieved through an integrated resonant structure that effectively utilizes the inductive and capacitive coupling between metal layers on either side of an ultrathin glass substrate or organic build-up layer. The designed filters (layout area c1 mm 2 with 80-150 μm device thickness) were fabricated on a 30-μm-thin glass substrate using a panel-based low-cost approach with double-side thin-film wiring processes. The effect of process variations on the performance of the proposed structures was also studied. Furthermore, an improved WLAN filter is designed and demonstrated by employing specific structural modifications. The measured frequency response of the filters shows good model-tohardware correlation, with very low insertion loss (0.6 dB) in the passband, and high adjacent-band rejection (>25 dB).
In this paper, we propose glass interposer electromagnetic bandgap (EBG) structure to efficiently suppress power/ground noise coupling. We designed, fabricated, measured, and analyzed a glass ...interposer EBG structure for the first time. Glass interposer EBG structure test vehicles were fabricated using a thin-glass substrate, low-loss polymer layers, and periodic metal patches with through glass vias (TGVs) in glass interposer power distribution network. Using the dispersion characteristics, we thoroughly analyzed and derived f L and f U of the glass interposer EBG structure. We experimentally verified that the proposed glass interposer EBG structure achieved power/ground noise suppression (below -40 dB) between f L of 5.8 GHz and f U of 9.6 GHz. Derived f L and f U based on dispersion analysis, full three-dimensional electromagnetic (3-D-EM) simulation and measurement achieved good correlation. In the glass interposer EBG structure, tapered structure of the TGV and thickness of the low-loss polymer used for metal-layers lamination affected the noise suppression bandgap significantly. The effectiveness of the proposed glass interposer EBG structure on suppression of the power/ground noise propagation and coupling to high-speed TGV channel was verified with 3-D-EM simulation. As a result, the proposed glass interposer EBG structure successfully and efficiently suppressed the power/ground noise propagation and improved eye-diagram of the high-speed TGV channel.
Ultrathin 3-D glass interposers with throughpackage vias at the same pitch as through-silicon vias (TSVs) have been proposed as a simpler and cheaper alternative to the direct 3-D stacking of logic ...and memory devices. Such 3-D interposers provide wide-I/O channels for high signal bandwidth (BW) between the logic device on one side of the interposer and memory stack on the other side, without the use of complex TSVs in the logic die. However, this configuration introduces power delivery design challenges due to resonance from: 1) the low-loss property of the glass substrate and 2) the parasitic inductance due to additional length from lateral power delivery path. This paper presents for the first time, the design and demonstration of power delivery networks (PDNs) in 30-μm thin, 3-D double-sided glass interposers, by suppressing the noise from mode resonances. The self-impedance of the 3-D glass interposer PDN was simulated using electromagnetic solvers, including printed-wiring-board and chip-level models. The 3-D PDN was compared with that of the 2-D glass packages having fully populated ball grid array connections. The resonance mechanism for each configuration was studied in detail, and the corresponding PDN loop inductances were evaluated. High impedance peaks in addition to the 2-D PDN were observed at high frequencies (near 7.3 GHz) in the 3-D interposer structure due to the increased inductances from lateral power delivery. This paper proposes and evaluates three important resonance suppression techniques based on: 1) 3-D interposer die configuration; 2) the selection and placement of decoupling capacitors; and 3) 3-D interposer package power and ground stack-up. Two-metal and four-metal layer test vehicles were fabricated on 30and 100-μm thick panel-based glass substrates, respectively, to validate the modeling and analysis of the proposed approach. The PDN test structures were characterized up to 20 GHz for plane resonances and network impedances, with good model-to-hardware correlation. The results in this paper suggest that the ultrathin 3-D interposer PDN structure can be effectively designed to meet the target impedance guidelines for high-BW applications, providing a compelling alternative to 3-D-IC stacking with the TSVs.
In this paper, we propose glass-interposer (GI) electromagnetic bandgap (EBG) structure with defected ground plane (DGP) for efficient and broadband suppression of power/ground noise coupling. We ...designed, fabricated, measured, and analyzed a GI-EBG structure with DGP for the first time. The proposed GI-EBG structure with DGP is thoroughly analyzed using the dispersion characteristics and estimated stopband edges, f L and f U . We experimentally verified that the proposed GI-EBG structure with DGP achieved power/ground noise isolation bandgap (below -30 dB) between f L of 5.7 GHz and f U of 11 GHz. Estimation of f L and f U using dispersion analysis, full 3-D electromagnetic (EM) simulation results, and measurement results achieved good correlation. Effectiveness of the proposed GI-EBG structure with DGP on suppression of the power/ground noise coupling to high-speed through glass via (TGV) channel is verified with 3-D EM simulation. As a result, the proposed EBG structure successfully and efficiently suppressed the power/ground noise coupling and improved the eye diagram of the TGV channel. Lastly, we embedded thin alumina film in the proposed EBG structure and achieved even broader power/ground noise suppression between 2.1 and 14.7 GHz.
This paper presents the design, analysis, and demonstration of an ultra-thin wireless local area network (WLAN) RF receiver module with chip-last embedded actives and embedded passives in a low-loss ...organic substrate using system-on-package approach. The overall thickness of the module, including the embedded dies, is 160 μm- more than 3× thickness reduction compared to current wire-bond and flip-chip packages. The receiver module consists of gallium arsenide low-noise amplifier (LNA) dies, chip-last embedded in an ultrathin, low-loss organic substrate, and connected to a substrate-embedded three-metal-layer band-pass filter (BPF) in close proximity. Full-wave electromagnetic simulation was performed on a 3-D model of the designed receiver module to obtain its two-port scattering parameters (S-parameters) and to study noise coupling between the power-supply network and the signal path. The receiver module was then fabricated, tested for yield of the BPF, assembled and characterized, and the measured results were correlated with simulation. The BPF dimensions in the package were 1.5 mm × 2.9 mm × 0.15 mm, and its measured pass-band insertion loss was 2.3 dB with more than 15 dB return loss. The receiver module (LNA + BPF) dimensions were 5.5 mm ×2 mm ×0.16 mm, and it had a measured peak gain of 11 dB with more than 30 dB attenuation in the adjacent-band, indicating excellent performance in a miniaturized form-factor.
This paper presents materials modeling, design, processing, integration and characterization of a new class of nanomagnetic structures for coupling and shielding in wireless charging and power ...conversion applications. Wireless power transfer applications such as wireless charging, operating at 6.78 MHz, require high-performance magnetic materials for enhancing the coupling between transceiver and receiver coils as well as for suppressing electromagnetic interference (EMI) shielding. This research describes two novel magnetic structures for coupling inductors and ultra-thin EMI shields. A novel vertically aligned magnetic composite structure was demonstrated for the coupling inductor. This structure is shown to result in permeabilities of above 500 and loss tangent of 0.01, which enhances the coupling inductance by 3-5x at 6.78 MHz, and also enhances the power-transfer efficiency by 2x. The second part of this paper presents the modeling, design and fabrication of nanomagnetic structures for ultra-thin EMI shields in wireless power transfer applications. The ultra-thin EMI shields for wireless power transfer described in this research can achieve greater than 20dB attenuation at 6.78 MHz even for 3-5μm shield thickness.
This paper systematically analyzes the impact of various physical design parameters on the electrical performance and optimizes the digital channel on a 2.5D organic interposer. The analysis focusses ...on mapping the impact of design parameters such as line width, spacing, dielectric thickness, metal thickness, presence of ground plane, and routing configuration on the bandwidth performance of the interconnect channel. It was observed that, while the cross-section of an interconnect played a role in the resistance, there are instances when the capacitive and inductive crosstalk and return-path coupling overshadow the benefits of a larger cross-section area. Further, Ground Signal Ground (GSG) routing configuration that seems less efficient, has been shown to offer performance gains and improved routing density over standard microstrip line (MSL). It has also been validated that, depending on the routing configuration, parameters such as the dielectric thickness or the presence of a ground plane may not have any impact on the performance; and hence offer additional freedom in terms of design and cost. Finally, optimization of a 2.5D interposer channel using GSG configuration has been presented.
This paper presents a modeling framework to optimize the development of hybrid bonding, starting with dielectric interface interactions, chemical-mechanical polishing (CMP) process, electrical ...performance, and thermo-mechanical reliability. The scale of analysis extends from the atomistic effects to the system-level effects, ensuring an all-round understanding and optimization of hybrid bonded interconnects.
