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Youngwoo Kim; Jonghyun Cho; Kyungjun Cho; Junyong Park; Subin Kim; Dong-Hyun Kim; Gapyeol Park; Sitaraman, Srikrishna; Raj, Pulugurtha Markondeya; Tummala, Rao R.; Joungho Kim
IEEE transactions on components, packaging, and manufacturing technology (2011), 09/2017, Volume: 7, Issue: 9Journal Article
In this paper, we propose glass-interposer (GI) electromagnetic bandgap (EBG) structure with defected ground plane (DGP) for efficient and broadband suppression of power/ground noise coupling. We designed, fabricated, measured, and analyzed a GI-EBG structure with DGP for the first time. The proposed GI-EBG structure with DGP is thoroughly analyzed using the dispersion characteristics and estimated stopband edges, f L and f U . We experimentally verified that the proposed GI-EBG structure with DGP achieved power/ground noise isolation bandgap (below -30 dB) between f L of 5.7 GHz and f U of 11 GHz. Estimation of f L and f U using dispersion analysis, full 3-D electromagnetic (EM) simulation results, and measurement results achieved good correlation. Effectiveness of the proposed GI-EBG structure with DGP on suppression of the power/ground noise coupling to high-speed through glass via (TGV) channel is verified with 3-D EM simulation. As a result, the proposed EBG structure successfully and efficiently suppressed the power/ground noise coupling and improved the eye diagram of the TGV channel. Lastly, we embedded thin alumina film in the proposed EBG structure and achieved even broader power/ground noise suppression between 2.1 and 14.7 GHz.
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