Modern Integrated circuits are severely affected by ESD (electro static discharge) which may severely affect the performance of ICs or may even lead to complete failure of the chip. electro static charge represents a very high voltage which gives rise to very high peak current causing problem of burn out in ICS. A per the Moore's law number of components on an Integrated circuit will double in every 18 to 24 months this results in miniaturization resulting in individual components becoming smaller each day. This makes integrated components more and more sensitive to the effects of damage occurring due to ESD. Even a small discharge through a very small component may cause result in cumulative overheating, or complete breakdown of the component. Various techniques are employed to overcome from ESD. Some of the techniques are use of products like static dissipative workbench, anti-static or static dissipative containers, or some designers even use especially custom designed ESD Protection devices in their circuits. Common ESD protection devices employs snap-back principle for protecting ICs from damage. snap-back characteristic is similar to a common silicon control-rectifier.