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刘猛 白书欣 李顺 赵恂 熊德赣
材料工程, 2016, Volume: 44, Issue: 8Journal Article
采用热压烧结法成功制备SiC_p/Cu复合材料。采用溶胶-凝胶工艺在SiC颗粒表面制备Mo涂层,研究Mo界面阻挡层对复合材料热物理性能的影响。结果表明:过氧钼酸溶胶-凝胶体系能够在SiC颗粒表面包覆连续性、均匀性较好的MoO_3涂层,最佳工艺配比为SiC∶MoO_3=5∶1(质量比)、过氧化氢∶乙醇=1∶1(体积比),SiC表面丙酮和氢氟酸预清洗处理有利于MoO_3涂层的沉积生长。MoO_3在540℃第一步氢气还原后转变为MoO_2,MoO_2在940℃第二步氢气还原后完全转变为Mo,Mo涂层包覆致密完整。热压烧结SiC_p/Cu复合材料微观组织致密均匀,且相比原始SiC颗粒增强的SiC_p/Cu,经溶胶-凝胶法界面改性处理的SiC_p/Cu复合材料热导率明显提高,SiC体积分数约为50%时,SiC_p/Cu复合材料热导率达到214.16W·m~(-1)·K~(-1)。
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