Ultrasmall Integrated 3D Micro-Supercapacitors Solve Energy Storage for Miniature Devices

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Ultrasmall Integrated 3D Micro-Supercapacitors Solve Energy Storage for Miniature Devices

Meng, Chuizhou; Maeng, Jimin; John, Simon W. M.; Irazoqui, Pedro P.

Advanced energy materials, 05/2014, Volume: 4, Issue: 7

Journal Article

A novel integrated 3D micro‐supercapacitor is reported. A through‐via bottom electrode technique is utilized for the first time for supercapacitor fabrication, and a highly miniaturized, flexible, and all‐solid‐state micro‐supercapacitor with 3D integration capability is achieved. Module‐wise compact integration of supercapacitors and their versatile powering applications are demonstrated. This device enables high‐power energy storage in small‐scale electronics.

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Meng, Chuizhou | Maeng, Jimin | John, Simon W. M. | Irazoqui, Pedro P.

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