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  • Numerical analysis of a sweat structure with an improved one dimensional nonlinear model
    Maček, Marijan ; Kordesch, Al. V. ; Osredkar, Radko
    An improved one dimensional (1-D) nonlinear model of the thermal response of the Standard Wafer-level Electromigration Accelerated test (SWEAT) structure is described. The major improvement in this ... model are accurate predictions of the critical current density ▫$j_o$▫; according to older models ▫$j_o$▫ is inversely proportional to the "power" ▫$I^2R/R(T_s)$▫, while our model shows a different (increasing) trend and is confirmed by measurements. The ratio of the maximum temperature increase to the average temperature increase ▫$(\gamma)$▫ for the investigated structure depends on the relative change of the resistance and normalized current ▫${A_o}^1/2 = I/I_{no}$▫, and can be calculated within 1% from basic material and structure parameters. The model includes the edge correction factor ▫$\alpha$▫ depending on the geometry of the structure ▫$(W_n/t_i)$▫ material parameters and stress current I. Using the corrected values for the edge correction factor, the maximum temperature increase in the SWEAT test structure can be calculated within less than 5°C.
    Vir: Microelectronics and reliability. - ISSN 0026-2714 (Vol. 34, No. 4, 1994, str. 689-702)
    Vrsta gradiva - članek, sestavni del
    Leto - 1994
    Jezik - angleški
    COBISS.SI-ID - 3254806

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