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  • Thermal cycling of temperature and strain rate dependent solder joints
    Skipor, A. F. ; Harren, S. V.
    In a previous paper, i.e., Skipor et al. (1996), 63/37 Sn/Pb eutectic solder was characterized with the viscoplastic model of Bodner and Partom (1975). The material parameters of the isotropic form ... of the Bodner-Partom model were found for the eutectic solder as functions of temperature. In the present paper, the resulting temperature dependent viscoplastic description for the eutectic is implemented in an infinitesimal strain incrementally linear finite element method. This finite element method is based on an explicit, second-order accurate time-integration scheme, which is presented herein. The finite element method so-obtained is then used to analyze two solder joint configurations under cyclic thermal loading. The results of the analyses show that, along with observed field performance of solder joints, the details of the plastic strain distribution within a joint, i.e., its magnitude and degree of diffuseness, can have large impact on joint reliability. Specifically, it is demonstrated that the geometric details of how solder in a joint connects to harder materials in an electronic package play a significant role.
    Vir: Mechanics of time-dependent materials : an international journal devoted to the time-dependent behaviour of materials and structures. - ISSN 1385-2000 (Vol. 2, no. 1, 1998, 59-83)
    Vrsta gradiva - članek, sestavni del
    Leto - 1998
    Jezik - angleški
    COBISS.SI-ID - 4031515

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