This paper reports on recent accomplishments and ongoing work of the ATLAS Planar Pixel Sensors R&D project. Special attention is given in particular to new testbeam results obtained with highly ...irradiated sensors, developments in the field of slim and active edges and first step towards prototypes of future pixel modules.
Whilst the thermal management needs of future silicon detectors are increasing, the required mass and volume minimization of all detector ancillaries gets more demanding. This requires highly ...effective active cooling in very small channels. In the context of the AIDA-2020 project, a new test stand has been developed to characterize, with unprecedented level of accuracy, boiling flows of CO2 in mini- and micro-channels with hydraulic diameter ranging from 2 down to 0.1 mm. The heat transfer coefficient and pressure drop behaviour in stainless steel tubular evaporators for saturation temperatures from ＋20 to −25 °C, mass fluxes from 1200 to 100 kg m−2 s−1 and heat fluxes from 0.5 to 3.5 W/cm2 are discussed for one diameter. In addition, high speed camera observations of CO2 flow patterns recorded on micro-structured silicon cold plates are used to help with the interpretation of the heat transfer coefficient and pressure drop trends reported.
In view of the LHC upgrade for the High Luminosity phase (HL-LHC), the ATLAS experiment plans to replace the Inner Detector with an all-silicon system. The n-on-p silicon technology is a promising ...candidate to achieve a large area instrumented with pixel sensors, since it is radiation hard and cost effective. The paper reports on the performance of thin 100 and 130μm n-in-p planar pixel sensors produced by FBK-CMM with active-edge technology in collaboration with LPNHE and INFN. Beam-test results are presented, with focus on the hit efficiency at the detector edge of a novel design consisting of a staggered deep trench.
Recent results on the search for new physics at BaBar and Belle B-factories are presented. The search for a light Higgs boson produced in the decay of different γ resonances is shown. In addition, ...recent measurements aimed to discover invisible final states produced by new physics mechanisms beyond the standard model are presented.
Abstract
ITk detector, the new ATLAS tracking system at High Luminosity LHC, will be equipped with 3D pixel sensor modules in the innermost layer (L0). The pixel cell dimensions will be either 25 × ...100 μm
2
(barrel) or 50 × 50 μm
2
(endcap), with one read-out electrode at the centre of a pixel and four bias electrodes at the corners. Sensors from pre-production wafers (50 × 50 μm
2
) produced by FBK have been bump bonded to ITkPixV1.1 chips at IZM. Bare modules have been assembled in Genoa on Single Chip Cards and characterized in laboratory and on beam.
In view of the LHC upgrade phase towards the High Luminosity LHC (HL-LHC), the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system.The n-on-p silicon technology is a ...promising candidate to achieve a large area instrumented with pixel sensors, since it is radiation hard and cost effective. The paper reports on the performance of thin (100 and 130μm thick) and edgeless n-on-p planar pixel sensors produced by FBK-CMM. The production featured standard 50μm×250μm pixel-pitch modules, compatible with the ATLAS FE-I4B readout chip, and small 50μm×50μm and 25μm×100μm pixel-pitch modules, compatible with the RD53A readout chip prototype. After discussing the sensor technology, an overview of 2018 testbeam results of the produced devices will be given, before and after irradiation, with a special focus on the hit efficiency at the detector edge.
This paper describes the AM06 chip, which is a highly parallel processor for pattern recognition in the ATLAS high energy physics experiment. The AM06 contains memory banks that store data organized ...in 18 bit words; a group of 8 words is called “pattern”. Each AM06 chip can store up to 131 072 patterns. The AM06 is a large chip, designed in 65 nm CMOS, and it combines full-custom memory arrays, standard logic cells and serializer/deserializer IP blocks at 2 Gbit/s for input/output communication. The overall silicon area is 168 mm2 and the chip contains about 421 million transistors. The AM06 receives the detector data for each event accepted by Level-1 trigger, up to 100 kHz, and it performs a track reconstruction based on hit information from channels of the ATLAS silicon detectors. Thanks to the design of a new associative memory cell and to the layout optimization, the AM06 consumption is only about 1 fJ/bit per comparison. The AM06 has been fabricated and successfully tested with a dedicated test system.
In view of the LHC upgrade phases towards the High Luminosity LHC (HL-LHC), the ATLAS experiment plans to upgrade the Inner Detector with an all-silicon system. The n-on-p silicon technology is a ...promising candidate to achieve a large area instrumented with pixel sensors, since it is radiation hard and cost effective. The presentation describes the performance of novel n-in-p edgeless planar pixel sensors produced by FBK-CMM, making use of the active trench for the reduction of the dead area at the periphery of the device. After discussing the sensor technology, some feedback from preliminary results of the first beam test will be discussed.
Performance of active edge pixel sensors Bomben, M.; Ducourthial, A.; Bagolini, A. ...
Journal of instrumentation,
05/2017, Letnik:
12, Številka:
5
Journal Article
Recenzirano
Odprti dostop
To cope with the High Luminosity LHC harsh conditions, the ATLAS inner tracker has to be upgraded to meet requirements in terms of radiation hardness, pile up and geometrical acceptance. The active ...edge technology allows to reduce the insensitive area at the border of the sensor thanks to an ion etched trench which avoids the crystal damage produced by the standard mechanical dicing process. Thin planar n-on-p pixel sensors with active edge have been designed and produced by LPNHE and FBK foundry. Two detector module prototypes, consisting of pixel sensors connected to FE-I4B readout chips, have been tested with beams at CERN and DESY. In this paper the performance of these modules are reported. In particular the lateral extension of the detection volume, beyond the pixel region, is investigated and the results show high hit efficiency also at the detector edge, even in presence of guard rings.
To cope with the harsh environment foreseen at the high luminosity conditions of HL-LHC, the ATLAS pixel detector has to be upgraded to be fully efficient with a good granularity, a maximized ...geometrical acceptance and an high read out rate. LPNHE, FBK and INFN are involved in the development of thin and edgeless planar pixel sensors in which the insensitive area at the border of the sensor is minimized thanks to the active edge technology. In this paper we report on two productions, a first one consisting of 200 μm thick n-on-p sensors with active edge, a second one composed of 100 and 130 μm thick n-on-p sensors. Those sensors have been tested on beam, both at CERN-SPS and at DESY. In terms of hit-efficiency, the first production reaches 99 % before irradiation and the second one reaches 96.3% after a fluence in excess of 1×1016neq/cm2. The performances of those two productions before and after irradiation will be presented in details.
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