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zadetkov: 319
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312.
  • Myocardial infarction in a ... Myocardial infarction in a neonate with hereditary antithrombin III deficiency
    Peeters, S; Vandenplas, Y; Jochmans, K ... Acta pædiatrica (Oslo), June 1993, Letnik: 82, Številka: 6-7
    Journal Article
    Recenzirano
    Odprti dostop

    We report the case of a newborn girl with antithrombin III deficiency type 1. The clinical features of a hypercoagulable condition that lead to this rare diagnosis differed from the reports in the ...
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313.
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314.
  • Room temperature and zero pressure high quality oxide direct bonding for 3D self-aligned assembly
    Dubey, Vikas; Van Huylenbroeck, Stefaan; Tutunjyan, Nina ... 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 2014-Dec.
    Conference Proceeding

    To keep up with the pace of decreasing transistor channel length, the demand for smaller pitch size is pushing 3D IC research into new approaches for stacking. As the pitch size decreases, the ...
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Dostopno za: IJS, NUK, UL, UM
315.
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316.
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317.
  • Corporate security responsi... Corporate security responsibility
    Wolf, Klaus Dieter; Nicole Deitelhoff ; Stefan Engert Cooperation and conflict, 42 : 2007 : 3
    Journal Article
    Recenzirano

    Inneholder sammendrag
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Dostopno za: BFBNIB, NMLJ, NUK, OILJ, PNG, SAZU, UKNU, UL, UM, UPUK
318.
  • Anforderungen an Traumareha... Anforderungen an Traumarehabilitationszentren
    Simmel Stefan Dr; Bork Hartmut; Eckhardt Rainer ... Der Unfallchirurg, 01/2021, Letnik: 124, Številka: 12
    Journal Article

    ZusammenfassungSchwer verletze Patienten benötigen nach Ende der Akutbehandlung eine qualifizierte und lückenlose Rehabilitation. Diese postakute Rehabilitation (Phase C) stellt hohe Anforderungen an ...
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Dostopno za: UPUK
319.
  • Statistical Distribution of... Statistical Distribution of Through-Silicon via Cu Pumping
    De Messemaeker, Joke; Roussel, Philippe J.; Pedreira, Olalla Varela ... IEEE transactions on device and materials reliability, 2017-Sept., 2017-9-00, Letnik: 17, Številka: 3
    Magazine Article
    Recenzirano

    Cu pumping is defined as the irreversible extrusion of Cu from Cu-filled through-silicon vias (TSVs) exposed to high temperatures. The distribution of Cu pumping values over the TSVs of a single ...
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Dostopno za: IJS, NUK, UL
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zadetkov: 319

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