Risk Management can reduce the risk of such as business processes that are not optimal, financial losses, declining reputation of the company, or the destruction of the company’s business. To reduce ...damage to the information systems of the company’s business process, there should be a risk management assessmentThe use of information systems required to support the company’s business processes, especially in education institution, as well as the MH. Thamrin University. In the use of information systems, will appear risks that will give negative impact on the institution. To reduce the negative impact, need to do a risk assessment. The method used in this thesis is the OCTAVE Allegro. Data were analyzed using the 8 steps in the OCTAVE Allegro, and distributing questionnaires to users of information systems. The result, there are 34 areas of concern is mitigated, and the overall user feedback states agreed on mitigation steps. It was concluded that a risk assessment is useful for reducing the risks of information system
Purpose This study aims to investigate the influence of different solder alloy materials on passive devices during laser soldering process. Solder alloy material has been found to significantly ...influence the solder joint’s quality, such as void formation that can lead to cracks, filling time that affects productivity and fillet shape that determines the solder joint’s reliability. Design/methodology/approach Finite volume method (FVM)-based simulation that was validated using real laser soldering experiment is used to evaluate the effect of various solder alloy materials, including SAC305, SAC387, SAC396 and SAC405 in laser soldering. These solders are commonly used to assemble the pin-through hole (PTH) capacitor onto the printed circuit board. Findings The simulation results show how the void ratio, filling time and flow characteristics of different solder alloy materials affect the quality of the solder joint. The optimal solder alloy is SAC396 due to its low void ratio of 1.95%, fastest filling time (1.3 s) to fill a 98% PTH barrel and excellent flow characteristics. The results give the ideal setting for the parameters that can increase the effectiveness of the laser soldering process, which include reducing filling time from 2.2 s to less than 1.5 s while maintaining a high-quality solder joint with a void ratio of less than 2%. Industries that emphasize reliable soldering and effective joint formation gain the advantage of minimal occurrence of void formation, quick filling time and exceptional flowability offered by this solution. Practical implications This research is expected not only to improve solder joint reliability but also to drive advancements in laser soldering technology, supporting the development of efficient and reliable microelectronics assembly processes for future electronic devices. The optimized laser soldering material will enable the production of superior passive devices, meeting the growing demands of the electronics market for smaller, high-performance electronic products. Originality/value The comparison of different solder alloy materials for PTH capacitor assembly during the laser soldering process has not been reported to date. Additionally, volume of fluid numerical analysis of the quality and reliability of different solder alloy joints has never been conducted on real PTH capacitor assemblies.
Corrosion characterization of Sn-Zn solder: a review Mohd Nazeri, Muhammad Firdaus; Yahaya, Muhamad Zamri; Gursel, Ali ...
Soldering & surface mount technology,
02/2019, Letnik:
31, Številka:
1
Journal Article
Recenzirano
Purpose
The purpose of this paper is to review and examine three of the most common corrosion characterization techniques specifically on Sn-Zn solders. The discussion will highlight the ...configurations and recent developments on each of the compiled characterization techniques of potentiodynamic polarization, potentiostatic polarization and electrochemical impedance spectroscopy (EIS).
Design/methodology/approach
The approach will incorporate a literature review of previous works related to the experimental setups and common parameters.
Findings
The potentiostatic polarization, potentiodynamic polarization and EIS were found to provide crucial and vital information on the corrosion properties of Sn-Zn solders. Accordingly, this solder relies heavily on the amount of Zn available because of the inability to produce the intermetallic compound in between the elements. Further, the excellent mechanical properties and low melting temperature of the Sn-Zn solder is undeniable, however, the limitations regarding corrosion resistance present opportunities in furthering research in this field to identify improvements. This is to ensure that the corrosion performance can be aligned with the outstanding mechanical properties. The review also identified and summarized the advantages, recent trends and important findings in this field.
Originality/value
The unique challenges and future research directions regarding corrosion measurement in Sn-Zn solders were shown to highlight the rarely discussed risks and problems in the reliability of lead-free soldering. Many prior reviews have been undertaken of the Sn-Zn system, but limited studies have investigated the corrosive properties. Therefore, this review focuses on the corrosive characterizations of the Sn-Zn alloy system.
Corrosion of the Cu/Sn–9Zn/Cu lap joints in 3.5wt.% NaCl solution showed reduction in the ultimate shear strength with increasing immersion time. The highest ultimate shear strength value obtained ...was at 122.67MPa before immersion while the lowest value was 85.32MPa after immersion for 28days. Corrosion products consist of tin (II) chloride and zinc hydroxide chloride had been obtained due to the active dissolution of tin. The formation of pits observed on the lap joints marked as stress concentration points which are detrimental toward the shear strength. Upon longer immersion period, the pit coalescence and propagation led to the existence of long, deep cracks. The fracture paths nucleates from the cracks clearly established the mechanism of the fracture formation for the Cu/Sn–9Zn/Cu lap joints. The fracture analysis together with the presence of the corrosion by-products fully reiterated that corrosion activities was the main factor for the decrease in shear strength of Cu/Sn–9Zn/Cu lap joints.
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