Universal Verification Methodology (UVM) is a standardized approach of verifying integrated circuit designs, targeting a Coverage-Driven Verification (CDV). It combines automatic test generation, ...self-checking testbenches, and coverage metrics to indicate progress in the design verification. The flow of the CDV differs from the traditional directed-testing approach. With the CDV, a testbench developer, by setting the verification goals, starts with an structured plan. Those goals are targeted further by a developed testbench, which generates legal stimuli and sends them to a device under test (DUT). The progress is measured by coverage monitors added to the simulation environment. In this way, the non-exercised functionality can be identified. Moreover, the additional scoreboards indicate undesired DUT behaviour. Such verification environments were developed for three recent ASIC and FPGA projects which have successfully implemented the new work-flow: (1) the CLICpix2 65 nm CMOS hybrid pixel readout ASIC design; (2) the C3PD 180 nm HV-CMOS active sensor ASIC design; (3) the FPGA-based DAQ system of the CLICpix chip. This paper, based on the experience from the above projects, introduces briefly UVM and presents a set of tips and advices applicable at different stages of the verification process-cycle.
High spatial resolution monolithic pixel detector in SOI technology Bugiel, R.; Bugiel, S.; Dannheim, D. ...
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
02/2021, Letnik:
988
Journal Article
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This paper presents test-beam results of monolithic pixel detector prototypes fabricated in 200 nm Silicon-On-Insulator (SOI) CMOS technology studied in the context of high spatial resolution ...performance. The tested detectors were fabricated on a 500 μm thick high-resistivity Floating Zone type n (FZ-n) wafer and on a 300 μm Double SOI Czochralski type p (DSOI Cz-p) wafer. The pixel size is 30 μm×30 μm and two different front-end electronics architectures were tested, a source follower and a charge-sensitive preamplifier. The test-beam data analyses were focused mainly on determination of the spatial resolution and the hit detection efficiency. In this work different cluster formation and position reconstruction methods are studied. In particular, a generalization of the standard η-correction adapted for arbitrary cluster sizes, is introduced. The obtained results give in the best case a spatial resolution of about 1.5 μm for the FZ-n wafer and about 3.0 μm for the DSOI Cz-p wafer, both detectors showing detection efficiency above 99.5%.
Timepix3 is a multi-purpose readout ASIC for hybrid pixel detectors. It can measure time and amplitude simultaneously by employing time-of-arrival (ToA) and time-over-threshold (ToT) techniques. Both ...methods are systematically affected by timewalk. In this paper, a method for pixel-by-pixel calibration of the time response is presented. Assemblies of Timepix3 ASICs bump-bonded to thin planar silicon pixel sensors with thicknesses of 50 μ m, 100 μ m and 150 μ m are calibrated and characterised in particle beams. For minimum ionising particles, time resolutions down to 0.72 ± 0.04 ns are achieved.
In order to achieve the challenging requirements on the CLIC vertex detector, a range of technology options have been considered in recent years. One prominent idea is the use of active sensors ...implemented in a commercial high-voltage CMOS process, capacitively coupled to hybrid pixel readout chips. Recent results have shown the approach to be feasible, though more detailed studies of the performance of such devices, including simulation, are required. The CLICdp collaboration has developed a number of ASICs as part of its vertex detector R&D programme, and here we present results on the performance of a CCPDv3 active sensor glued to a CLICpix readout chip. Charge collection characteristics and tracking performance have been measured over the full expected angular range of incident particles using 120 GeV/c secondary hadron beams from the CERN SPS. Single hit efficiencies have been observed above 99% in the full range of track incidence angles, down to shallow angles. The single hit resolution has also been observed to be stable over this range, with a resolution around 6µm. The measured charge collection characteristics have been compared to simulations carried out using the Sentaurus TCAD finite-element simulation package combined with circuit simulations and parametrisations of the readout chip response. The simulations have also been successfully used to reproduce electric fields, depletion depths and the current–voltage characteristics of the device, and have been further used to make predictions about future device designs.
The concept of capacitive coupling between sensors and readout chips is under study for the vertex detector at the proposed high-energy CLIC electron positron collider. The CLICpix Capacitively ...Coupled Pixel Detector (C3PD) is an active High-Voltage CMOS sensor, designed to be capacitively coupled to the CLICpix2 readout chip. The chip is implemented in a commercial 180 nm HV-CMOS process and contains a matrix of 128×128 square pixels with 25μm pitch. First prototypes have been produced with a standard resistivity of ∼20Ωcm for the substrate and tested in standalone mode. The results show a rise time of ∼20 ns, charge gain of 190 mV/ke− and ∼40 e− RMS noise for a power consumption of 4.8μW/pixel. The main design aspects, as well as standalone measurement results, are presented.
The main goals of the TOTEM Experiment at the LHC are the measurements of the elastic and total p-p cross sections and the studies of the diffractive dissociation processes. At LHC, collisions are ...produced at a rate of 40 MHz, imposing strong requirements for the Data Acquisition Systems (DAQ) in terms of trigger rate and data throughput. The VME based Front End Driver (FED) modules, host mezzanines that receive data through optical fibres directly from the detectors. In order to get rid of the VME bottleneck and improve scalability and the overall capabilities of the DAQ, a new system was designed and constructed based on the Scalable Readout System (SRS), developed in the framework of the RD51 Collaboration. The project aims to increase the efficiency of the actual readout system providing higher bandwidth, and increasing data filtering, implementing a second-level trigger event selection based on hardware pattern recognition algorithms. The obtained results and the perspectives of the project are reported.
The TOTEM collaboration has measured the proton–proton total cross section at
s
=
13
TeV
with a luminosity-independent method. Using dedicated
β
∗
=
90
m
beam optics, the Roman Pots were inserted ...very close to the beam. The inelastic scattering rate has been measured by the T1 and T2 telescopes during the same LHC fill. After applying the optical theorem the total proton–proton cross section is
σ
tot
=
(
110.6
±
3.4
) mb, well in agreement with the extrapolation from lower energies. This method also allows one to derive the luminosity-independent elastic and inelastic cross sections:
σ
el
=
(
31.0
±
1.7
)
mb
and
σ
inel
=
(
79.5
±
1.8
)
mb
.
Celotno besedilo
Dostopno za:
DOBA, IZUM, KILJ, NUK, PILJ, PNG, SAZU, SIK, UILJ, UKNU, UL, UM, UPUK
The TOTEM experiment at the LHC has performed the first measurement at
s
=
13
TeV
of the
ρ
parameter, the real to imaginary ratio of the nuclear elastic scattering amplitude at
t
=
0
, obtaining the ...following results:
ρ
=
0.09
±
0.01
and
ρ
=
0.10
±
0.01
, depending on different physics assumptions and mathematical modelling. The unprecedented precision of the
ρ
measurement, combined with the TOTEM total cross-section measurements in an energy range larger than
10
TeV
(from 2.76 to
13
TeV
), has implied the exclusion of all the models classified and published by COMPETE. The
ρ
results obtained by TOTEM are compatible with the predictions, from other theoretical models both in the Regge-like framework and in the QCD framework, of a crossing-odd colourless 3-gluon compound state exchange in the
t
-channel of the proton–proton elastic scattering. On the contrary, if shown that the crossing-odd 3-gluon compound state
t
-channel exchange is not of importance for the description of elastic scattering, the
ρ
value determined by TOTEM would represent a first evidence of a slowing down of the total cross-section growth at higher energies. The very low-|
t
| reach allowed also to determine the absolute normalisation using the Coulomb amplitude for the first time at the LHC and obtain a new total proton–proton cross-section measurement
σ
tot
=
(
110.3
±
3.5
)
mb
, completely independent from the previous TOTEM determination. Combining the two TOTEM results yields
σ
tot
=
(
110.5
±
2.4
)
mb
.
Celotno besedilo
Dostopno za:
DOBA, IZUM, KILJ, NUK, PILJ, PNG, SAZU, SIK, UILJ, UKNU, UL, UM, UPUK
The TOTEM collaboration has measured the elastic proton-proton differential cross section
d
σ
/
d
t
at
s
=
13
TeV LHC energy using dedicated
β
∗
=
90
m beam optics. The Roman Pot detectors were ...inserted to 10
σ
distance from the LHC beam, which allowed the measurement of the range 0.04 GeV
2
; 4 GeV
2
in four-momentum transfer squared |
t
|. The efficient data acquisition allowed to collect about 10
9
elastic events to precisely measure the differential cross-section including the diffractive minimum (dip), the subsequent maximum (bump) and the large-|
t
| tail. The average nuclear slope has been found to be
B
=
(
20.40
±
0
.
002
stat
±
0
.
01
syst
)
GeV
-
2
in the |
t
|-range 0.04–0.2 GeV
2
. The dip position is
|
t
dip
|
=
(
0.47
±
0
.
004
stat
±
0
.
01
syst
)
GeV
2
. The differential cross section ratio at the bump vs. at the dip
R
=
1.77
±
0
.
01
stat
has been measured with high precision. The series of TOTEM elastic pp measurements show that the dip is a permanent feature of the pp differential cross-section at the TeV scale.
Celotno besedilo
Dostopno za:
DOBA, IZUM, KILJ, NUK, PILJ, PNG, SAZU, SIK, UILJ, UKNU, UL, UM, UPUK
The TOTEM experiment at the CERN LHC has measured elastic proton–proton scattering at the centre-of-mass energy
s
=
8
TeV and four-momentum transfers squared, |
t
|, from
6
×
10
-
4
to 0.2 GeV
2
. ...Near the lower end of the
t
-interval the differential cross-section is sensitive to the interference between the hadronic and the electromagnetic scattering amplitudes. This article presents the elastic cross-section measurement and the constraints it imposes on the functional forms of the modulus and phase of the hadronic elastic amplitude. The data exclude the traditional Simplified West and Yennie interference formula that requires a constant phase and a purely exponential modulus of the hadronic amplitude. For parametrisations of the hadronic modulus with second- or third-order polynomials in the exponent, the data are compatible with hadronic phase functions giving either central or peripheral behaviour in the impact parameter picture of elastic scattering. In both cases, the
ρ
-parameter is found to be
0.12
±
0.03
. The results for the total hadronic cross-section are
σ
tot
=
(
102.9
±
2.3
)
mb and
(
103.0
±
2.3
)
mb for central and peripheral phase formulations, respectively. Both are consistent with previous TOTEM measurements.
Celotno besedilo
Dostopno za:
DOBA, IZUM, KILJ, NUK, PILJ, PNG, SAZU, SIK, UILJ, UKNU, UL, UM, UPUK
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