Abstract
CERN is planning to upgrade its Large Hadron Collider to the High Luminosity phase (HL-LHC), pushing detector technologies to cope with unprecedently demanding performance in terms of ...particle rate and radiation hardness. The ATLAS experiment decided to equip the innermost layer (L0) of its Inner Tracker (ITk) with small-pitch 3D pixels of two different geometries, i.e., 25 µm × 100 µm for the central barrel and 50 µm × 50 µm for the lateral rings. A new generation of 3D pixels featuring these small-pitch dimensions and reduced active thickness (∼150 µm) has been developed to this purpose within a collaboration of INFN and FBK since 2014. Recently, the R&D activities have been focused on the characterization of modules based on sensors compatible with the RD53A readout chip, which were tested in laboratory and at beam lines. In this paper, we report on the characterization of modules irradiated with protons up to a fluence of 1 × 10
16
n
eq
/cm
2
, including threshold tuning and noise measurements, and results from beam tests performed at DESY. Moreover, we will discuss about the electrical characteristics at wafer level and at module level before and after irradiation.
Abstract
ITk detector, the new ATLAS tracking system at High Luminosity LHC, will be equipped with 3D pixel sensor modules in the innermost layer (L0). The pixel cell dimensions will be either 25 × ...100 μm
2
(barrel) or 50 × 50 μm
2
(endcap), with one read-out electrode at the centre of a pixel and four bias electrodes at the corners. Sensors from pre-production wafers (50 × 50 μm
2
) produced by FBK have been bump bonded to ITkPixV1.1 chips at IZM. Bare modules have been assembled in Genoa on Single Chip Cards and characterized in laboratory and on beam.
The ATLAS pixel detector Gemme, C.
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
03/2003, Letnik:
501, Številka:
1
Journal Article
Recenzirano
The ATLAS experiment will use a pixel detector as the innermost part of its semiconductor tracker. The pixel detector consists of three cylindrical layers in the barrel part and three disks in the ...forward and backward parts. The detector is designed to operate with a
40
MHz
bunch crossing frequency, a high particle flux density and an extreme radiation environment at LHC. The main characteristics of the project are illustrated together with recent experimental results.
The ATLAS Pixel detector is designed to sustain high dose integrated over several years of operation. Nevertheless, the radiation hardness should also favour the survival of the detector in case of ...accidental beam losses. An experiment performed in 2006 showed that ATLAS Pixel detector modules (silicon planar coupled with FE-I3 electronics) could survive to beam losses up to 1.5ċ1010 protons/cm2 in a single bunch with minimal or no deterioration of performance. The upgrade of LHC to even higher luminosity (HL-LHC) calls for a new test of these properties. Two test beam campaigns have been conducted in 2017 and 2018 at the High-Radiation to Materials (HiRadMat) facility of the CERN Super Proton Synchrotron in order to establish for the first time the survival threshold of different types of ATLAS IBL pixel modules under very intense proton beam irradiation.
Effects of Single Event Upsets (SEU) and Single Event Transients (SET) are studied in the FE-I4B chip of the innermost layer of the ATLAS pixel system. SEU/SET affect the FE-I4B Global Registers as ...well as the settings for the individual pixels, causing, among other things, occupancy losses, drops in the low voltage currents, noisy pixels, and silent pixels. Quantitative data analysis and simulations indicate that SET dominate over SEU on the load line of the memory. Operational issues and mitigation techniques are presented.
Test beam results of 3D silicon pixel sensors for the ATLAS upgrade Grenier, P.; Alimonti, G.; Barbero, M. ...
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
05/2011, Letnik:
638, Številka:
1
Journal Article
Recenzirano
Odprti dostop
Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable B-Layer and High Luminosity LHC (HL-LHC) upgrades are presented. Measurements include charge collection, tracking ...efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6
T magnetic field oriented as the ATLAS inner detector solenoid field. Sensors were bump-bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance.
In this paper we discuss results relevant to 3D Double-Side Double Type Column (3D-DDTC) pixel sensors fabricated at FBK (Trento, Italy) and oriented to the ATLAS upgrade. Some assemblies of these ...sensors featuring different columnar electrode configurations (2, 3, or 4 columns per pixel) and coupled to the ATLAS FEI3 read-out chip were irradiated up to large proton fluences and tested in laboratory with radioactive sources. In spite of the non-optimized columnar electrode overlap, sensors exhibit reasonably good charge collection properties up to an irradiation fluence of 2×1015neqcm−2, while requiring bias voltages in the order of 100V. Sensor operation is further investigated by means of TCAD simulations which can effectively explain the basic mechanisms responsible for charge loss after irradiation.
3D-FBK pixel sensors: Recent beam tests results with irradiated devices Micelli, A.; Helle, K.; Sandaker, H. ...
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
09/2011, Letnik:
650, Številka:
1
Journal Article
Recenzirano
Odprti dostop
The Pixel Detector is the innermost part of the ATLAS experiment tracking device at the Large Hadron Collider, and plays a key role in the reconstruction of the primary vertices from the collisions ...and secondary vertices produced by short-lived particles. To cope with the high level of radiation produced during the collider operation, it is planned to add to the present three layers of silicon pixel sensors which constitute the Pixel Detector, an additional layer (Insertable B-Layer, or IBL) of sensors. 3D silicon sensors are one of the technologies which are under study for the IBL. 3D silicon technology is an innovative combination of very-large-scale integration and Micro-Electro-Mechanical-Systems where electrodes are fabricated inside the silicon bulk instead of being implanted on the wafer surfaces. 3D sensors, with electrodes fully or partially penetrating the silicon substrate, are currently fabricated at different processing facilities in Europe and USA. This paper reports on the 2010 June beam test results for irradiated 3D devices produced at FBK (Trento, Italy). The performance of these devices, all bump-bonded with the ATLAS pixel FE-I3 read-out chip, is compared to that observed before irradiation in a previous beam test.
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