Effect of accidental beam losses on the ATLAS pixel detector Andreazza, A.; Einsweiler, K.; Gemme, C. ...
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
09/2006, Letnik:
565, Številka:
1
Journal Article
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Odprti dostop
The ATLAS pixel detector has been designed to sustain a dose of 500
kGy integrated over 10 years of operation. This very substantial radiation hardness should also favor the survival of the detector ...in case of accidental beam losses. The effect of a very intensive beam releasing a high instantaneous dose in the pixel detector has been measured in a short experiment performed at the CERN Proton Synchrotron. The results confirm that the ATLAS pixel detector can survive to beam losses with minimal or no deterioration of performance.
The High Luminosity upgrade of the CERN-LHC (HL-LHC) demands for a new high-radiation tolerant solid-state pixel sensor capable of surviving fluencies up to a few 1016 particles/cm2 at ~3 cm from the ...interaction point. To this extent the INFN ATLAS-CMS joint research activity, in collaboration with Fondazione Bruno Kessler-FBK, is aiming at the development of thin n-in-p type pixel sensors for the HL-LHC. The R&D covers both planar and single-sided 3D columnar pixel devices made with the Si-Si Direct Wafer Bonding technique, which allows for the production of sensors with 100 μm and 130 μm active thickness for planar sensors, and 130 μm for 3D sensors, the thinnest ones ever produced so far. The first prototypes of hybrid modules bump-bonded to the present CMS and ATLAS readout chips have been tested in beam tests. Furthermore, the preliminary results on their performance before and after irradiation are presented.
After the first successful LHC run in 2010-2012, plans are actively advancing for a series of upgrades leading eventually to about above times the design-luminosity in about ten years. The larger ...luminosity will allow to perform precise measurements of the just discovered Higgs boson and to continue searching for new physics beyond the Standard Model. Coping with the high instantaneous and integrated luminosity will be a great challenge for the ATLAS detector and will require changes in most of the subsystems, specially those at low radii and large pseudorapidity, as well as in its trigger architecture. Plans to consolidate and, whenever possible, to improve the physics performance of the current detector over the next decade are summarized in this paper.
Using a sample of 10
8 triggered events, produced in
350
GeV/c
π
− interactions in a copper target, we have identified 26 bb̄ events. These include 13 events where the decays of both
B and
B
are well ...reconstructed. We measure the azimuthal correlation between beauty particles, and compare our result with predictions based on perturbative QCD.
Using a sample of 26 bb̄ events, produced in 350GeV/cπ− interactions in a copper target, which includes 13 events where the decays of both B and B are well reconstructed, we measure the differential ...distributions with respect to xF and pT2 as well as some two-particle kinematic variables. We also compare our results with a previous experiment and with predictions based on perturbative QCD.
Using a sample of 10
8 triggered events, produced in π-Cu interactions at 350 GeV/
c, we have identified 26 beauty events. The estimated background in this sample is 0.6 ± 0.6 events. From these ...data, assuming a linear A-dependence, we measure a beauty production cross-section integrated over all
x
F
of 5.7
+1.3
-1.1 (stat.)
+0.6
-0.5 (syst.)nb/N. Differential distributions with respect to
x
F
and
p
2
T
have been determined as well as some two-particle kinematic variables. Our results are compared with previous experiments and with a next-to-leading-order QCD calculation.
Analysis of the production of ATLAS indium bonded pixel modules Alimonti, G.; Andreazza, A.; Bulgheroni, A. ...
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
09/2006, Letnik:
565, Številka:
1
Journal Article
Recenzirano
The ATLAS collaboration is currently building 1500 pixel modules using the indium bump bonding technique developed by SELEX Sistemi Integrati (former AMS). The indium deposition and flip-chip process ...are described together with an overview of the chip stripping machine that allows defective modules to be reworked. The production is half-way through at the time of this writing. This paper also discusses the problems encountered during production and the adopted solutions.
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