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zadetkov: 467
451.
  • BALANCE-a flexible parallel... BALANCE-a flexible parallel load balancing system for heterogeneous computing systems and networks
    Chi-Chung Hui; Chanson, S.T.; Pui-Man Chui ... Proceedings of IEEE INFOCOM '96. Conference on Computer Communications, 1996, Letnik: 2
    Conference Proceeding

    The design philosophy and implementation of the BALANCE system is described. BALANCE is a flexible, network independent and computer architecture independent load balancing system which is designed ...
Celotno besedilo
Dostopno za: IJS, NUK, UL, UM
452.
Celotno besedilo
Dostopno za: IJS, KILJ, NUK, UL
453.
  • Origin of low-frequency (in... Origin of low-frequency (intraseasonal) oscillations in the tropical atmosphere. II - Structure and propagation of mobile wave-CISK modes and their modification by lower boundary forcings
    Sui, Chung-Hsiung; Lau, Ka-Ming Journal of the atmospheric sciences, 01/1989, Letnik: 46, Številka: 1
    Journal Article
    Recenzirano

    An improved treatment of diabatic heating due to moist convection is introduced into the dynamical model of Lau and Peng (1987) to study the origin of intraseasonal oscillations in the tropics. It is ...
Celotno besedilo
Dostopno za: NUK, UL, UM, UPUK
454.
Celotno besedilo
455.
  • 3つの大循環モデルにおける熱帯季節内変動の構造の評価 3つの大循環モデルにおける熱帯季節内変動の構造の評価
    気象集誌. 第2輯, 1990, Letnik: 68, Številka: 4
    Journal Article
    Recenzirano
    Odprti dostop

    3つの大循環モデル(GCM)の季節サイクル積分に現れる低周波振動が、ヨーロッパ中期予報センター(ECMWF)の解析と比較される。どのモデルも、緯度3度、経度5度、鉛直9層の同じ分解能である。GLAS GCMは熱帯対流圏上層の発散場における30-60日の東進を再現している。この東進する惑星規模成分は、観測と同様にインドネシア域で定在的で、中部太平洋で加速している。GLA ...
Celotno besedilo
Dostopno za: NUK, UL, UM, UPUK

PDF
456.
  • Through-Silicon Hole Interposers for 3-D IC Integration
    Lau, John H; Lee, Ching-Kuan; Zhan, Chau-Jie ... Components, Packaging and Manufacturing Technology, IEEE Transactions on, 2014-Sept.-, Letnik: 4
    Standard
    Odprti dostop

    In this investigation, a system-in-package (SiP) that consists of a very low-cost interposer with through-silicon holes (TSHs) and with chips on its top and bottom sides (a real 3-D IC integration) ...
Celotno besedilo

PDF
457.
Celotno besedilo
Dostopno za: UM
458.
Celotno besedilo
459.
Celotno besedilo
460.
Celotno besedilo
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