Ta-based ohmic contacts to gallium nitride high electron mobility transistor (GaN HEMT) epitaxial structures were investigated. Two metallization schemes were considered: Ta/Al/Ni(Ta)/Au and ...Ta/Al/Ta. The latter was superior in terms of lower contact resistance (R-c) and wider process window. The metallizations were applied to two different heterostructures (GaN/Al0.14Ga0.86N/GaN and Al0.25Ga0.75N/GaN). The lowest measured R-c was 0.06 and 0.28 Omega mm, respectively. The main advantage of the Ta-based ohmic contacts over conventional Ti-based contacts was the low anneal temperature. The optimum temperature of annealing was found to be 550-575 degrees C. From optical and scanning electron microscopy, it was clear that excellent surface morphology and edge acuity were obtained at these low temperatures. This facilitates lateral scaling of the GaN HEMT. TEM images were taken of the contact cross sections onto which EDX measurements were performed. The aim was to investigate the microstructure and the contact mechanism. Storage tests at 300 degrees C for more than 400 h in air ambient showed no deterioration of R-c.
We report on the electrical properties of Al2O3 films grown on 4H-SiC by successive thermal oxidation of thin Al layers at low temperatures (200°C - 300°C). MOS capacitors made using these films ...contain lower density of interface traps, are more immune to electron injection and exhibit higher breakdown field (5MV/cm) than Al2O3 films grown by atomic layer deposition (ALD) or rapid thermal processing (RTP). Furthermore, the interface state density is significantly lower than in MOS capacitors with nitrided thermal silicon dioxide, grown in N2O, serving as the gate dielectric. Deposition of an additional SiO2 film on the top of the Al2O3 layer increases the breakdown voltage of the MOS capacitors while maintaining low density of interface traps. We examine the origin of negative charges frequently encountered in Al2O3 films grown on SiC and find that these charges consist of trapped electrons which can be released from the Al2O3 layer by depletion bias stress and ultraviolet light exposure. This electron trapping needs to be reduced if Al2O3 is to be used as a gate dielectric in SiC MOS technology.
The formation of recess etched Au-free ohmic contacts to an InAlN AlN GaN heterostructure is investigated. A Ta Al Ta metal stack is used to produce contacts with contact resistance (Rc) as low as ...0.14 mm. It is found that Rc decreases with increasing recess depth until the InAlN barrier is completely removed. For even deeper recesses Rc remains low but requires annealing at higher temperatures for contact formation. The lowest Rc is found for contacts where the recess etch has stopped just above the 2D electron gas channel. At this depth the contacts are also found to be less sensitive to other process parameters, such as anneal duration and temperature. An optimum bottom Ta layer thickness of 5-10 nm is found. Two reliability experiments preliminary confirm the stability of the recessed contacts.
The effects of humidity on the electronic properties of quasi-free standing one layer graphene (QFS 1LG) are investigated via simultaneous magneto-transport in the van der Pauw geometry and local ...work function measurements in a controlled environment. QFS 1LG on 4H-SiC(0001) is obtained by hydrogen intercalation of the interfacial layer. In this system, the carrier concentration experiences a two-fold increase in sensitivity to changes in relative humidity as compared to the as-grown epitaxial graphene. This enhanced sensitivity to water is attributed to the lowering of the hydrophobicity of QFS 1LG, which results from spontaneous polarization of 4H-SiC(0001) strongly influencing the graphene. Moreover, the superior carrier mobility of the QFS 1LG system is retained even at the highest humidity. The work function maps constructed from Kelvin probe force microscopy also revealed higher sensitivity to water for 1LG compared to 2LG in both QFS 1LG and as-grown systems. These results point to a new field of applications for QFS 1LG, i.e., as humidity sensors, and the corresponding need for metrology in calibration of graphene-based sensors and devices.
PDF
