A systematic study of BNL's 3D-Trench Electrode detectors Montalbano, A; Bassignana, D; Li, Z ...
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
11/2014, Letnik:
765
Journal Article
Recenzirano
New types of silicon pixel detectors have been proposed because of the need for more radiation hard semiconductor devices for the high luminosity tracking detector upgrades at the Large Hadron ...Collider. A novel type of 3D Si pixel detectors is proposed, with each cell of the 3D-Trench Electrode pixel detector featuring a concentric trench electrode surrounding the central collecting column electrode. The pixel sensor is an array of those individual cells. Systematic 3D simulations using Silvacos TCAD programs have been carried out to study the characteristics of this novel 3D pixel design and to compare to the traditional 3D column electrode pixel design. The 3D simulations show a much lower depletion voltage and a more uniform electric field in the new 3D-Trench Electrode pixel detectors as compared to the traditional 3D column Electrode detectors. The first prototype 3D-Trench Electrode pixel detectors have been manufactured at the Centro Nacional De Microelectronica. Preliminary electrical measurements are discussed and charge collection efficiency measurements are presented.
Images of uniformly illuminated sensors for the Large Synoptic Survey Telescope have circular periodic patterns with an appearance similar to tree rings. These patterns are caused by circularly ...symmetric variations of the dopant concentration in the monocrystal silicon boule induced by the manufacturing process. Non-uniform charge density results in the parasitic electric field inside the silicon sensor, which may distort shapes of astronomical sources. In this study we analyzed data from fifteen LSST sensors produced by ITL to determine the main parameters of the tree rings: amplitude and period, and also variability across the sensors tested at Brookhaven National Laboratory. Tree ring pattern has a weak dependence on the wavelength. However the ring amplitude gets smaller as wavelength gets longer, since longer wavelengths penetrate deeper into the silicon. Tree ring amplitude gets larger as it gets closer to the outer part of the wafer, from 0.1 to 1.0%, indicating that the resistivity variation is larger for larger radii.
The performance of the CDF luminosity monitor Acosta, D; Klimenko, S; Konigsberg, J ...
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
11/2002, Letnik:
494, Številka:
1
Journal Article
Recenzirano
We describe the initial performance of the detector used for the luminosity measurement in the CDF experiment in Run II at the Tevatron. The detector consists of low-mass gaseous Cherenkov counters ...with high light yield (∼100 photoelectrons) and monitors the process of inelastic
p
p
̄
scattering. It allows for several methods of precise luminosity measurements at peak instantaneous luminosities of
2×10
32
cm
−2
s
−1
, corresponding to an average of six
p
p
̄
interactions per bunch crossing.
Test beam results of 3D silicon pixel sensors for the ATLAS upgrade Grenier, P.; Alimonti, G.; Barbero, M. ...
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
05/2011, Letnik:
638, Številka:
1
Journal Article
Recenzirano
Odprti dostop
Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable B-Layer and High Luminosity LHC (HL-LHC) upgrades are presented. Measurements include charge collection, tracking ...efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6
T magnetic field oriented as the ATLAS inner detector solenoid field. Sensors were bump-bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance.
3D-FBK pixel sensors: Recent beam tests results with irradiated devices Micelli, A.; Helle, K.; Sandaker, H. ...
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
09/2011, Letnik:
650, Številka:
1
Journal Article
Recenzirano
Odprti dostop
The Pixel Detector is the innermost part of the ATLAS experiment tracking device at the Large Hadron Collider, and plays a key role in the reconstruction of the primary vertices from the collisions ...and secondary vertices produced by short-lived particles. To cope with the high level of radiation produced during the collider operation, it is planned to add to the present three layers of silicon pixel sensors which constitute the Pixel Detector, an additional layer (Insertable B-Layer, or IBL) of sensors. 3D silicon sensors are one of the technologies which are under study for the IBL. 3D silicon technology is an innovative combination of very-large-scale integration and Micro-Electro-Mechanical-Systems where electrodes are fabricated inside the silicon bulk instead of being implanted on the wafer surfaces. 3D sensors, with electrodes fully or partially penetrating the silicon substrate, are currently fabricated at different processing facilities in Europe and USA. This paper reports on the 2010 June beam test results for irradiated 3D devices produced at FBK (Trento, Italy). The performance of these devices, all bump-bonded with the ATLAS pixel FE-I3 read-out chip, is compared to that observed before irradiation in a previous beam test.
3D silicon pixel sensors: Recent test beam results Hansson, P.; Balbuena, J.; Barrera, C. ...
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
02/2011, Letnik:
628, Številka:
1
Journal Article
Recenzirano
The 3D silicon sensors aimed for the ATLAS pixel detector upgrade have been tested with a high energy pion beam at the CERN SPS in 2009. Two types of sensor layouts were tested: full-3D assemblies ...fabricated in Stanford, where the electrodes penetrate the entire silicon wafer thickness, and modified-3D assemblies fabricated at FBK-irst with partially overlapping electrodes. In both cases three read-out electrodes are ganged together to form pixels of dimension
50
×
400
μ
m
2
. Data on the pulse height distribution, tracking efficiency and resolution were collected for various particle incident angles, with and without a 1.6
T magnetic field. Data from a planar sensor of the type presently used in the ATLAS detector were used at the same time to give comparison.
We present the observation of doubly-produced $J/\psi$ mesons with the D0 detector at Fermilab in $p\bar{p}$ collisions at $\sqrt{s}=1.96$ TeV. The production cross section for both singly and ...doubly-produced $J/\psi$ mesons is measured using a sample with an integrated luminosity of 8.1~fb$^{-1}$. For the first time, the double $J/\psi$ production cross section is separated into contributions due to single and double parton scatterings. Using these measurements, we determine the effective cross section \sigteff, a parameter characterizing an effective spatial area of the parton-parton interactions and related to the parton spatial density inside the nucleon.
We describe an analysis comparing the p (p) over bar elastic cross section as measured by the D0 Collaboration at a center-of-mass energy of 1.96 TeV to that in pp collisions as measured by the TOTEM ...Collaboration at 2.76, 7, 8, and 13 TeVusing a model-independent approach. The TOTEM cross sections, extrapolated to a center-of-mass energy of root s = 1.96 TeV, are compared with the D0 measurement in the region of the diffractive minimum and the second maximum of the pp cross section. The two data sets disagree at the 3.4s level and thus provide evidence for the t-channel exchange of a colorless, C-odd gluonic compound, also known as the odderon. We combine these results with a TOTEM analysis of the same C-odd exchange based on the total cross section and the ratio of the real to imaginary parts of the forward elastic strong interaction scattering amplitude in pp scattering for which the significance is between 3.4s and 4.6s. The combined significance is larger than 5 sigma and is interpreted as the first observation of the exchange of a colorless, C-odd gluonic compound.
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