Using the Hall effect measurements, it is established that the sign of carriers in the LuxMn1–xS solid solutions changes upon temperature and concentration variations. The extrema in the temperature ...dependence of the electrical resistance and hysteresis of the electric polarization are found. The change in the sign of the exchange coupling between the nearest neighbors under electron doping is established. The magnetoresistance in the paramagnetic region is caused by the change in the induced electric polarization in a magnetic field.
In the LuxMn1−xS compound, the magnetoresistance changes sign from negative to positive at the heating. The resistance decreases in a magnetic field due to a change in the induced electric polarization of clusters with lutetium in a magnetic field. The positive magnetoresistance at high temperatures is explained within the Maxwell–Wagner model with two conduction channels.
We fabricated Cu-doped TiNxOy thin film resistors by using atomic layer deposition, optical lithography, dry etching, Ti/Cu/Ti/Au e-beam evaporation and lift-off processes. The results of the ...measurements of the resistance temperature dependence, non-linearity, S-parameters at 0.01–26 GHz and details of the breakdown mechanism under high-voltage stress are reported. The devices’ sheet resistance is 220 ± 8 Ω/□ (480 ± 20 µΩ*cm); intrinsic resistance temperature coefficient (TCR) is ~400 ppm/°C in the T-range of 10–300 K; and S-parameters versus frequency are flat up to 2 GHz with maximum variation of 10% at 26 GHz. The resistors can sustain power and current densities up to ~5 kW*cm−2 and ~2 MA*cm−2, above which they switch to high-resistance state with the sheet resistance equal to ~200 kΩ/□ (~0.4 Ω*cm) caused by nitrogen and copper desorption from TiNxOy film. The Cu/Ti/TiNxOy contact is prone to ageing due to gradual titanium oxidation while the TiNxOy resistor body is stable. The resistors have strong potential for applications in high-frequency integrated and hybrid circuits that require small-footprint, medium-range resistors of 0.05–10 kΩ, with small TCR and high-power handling capability.
Copper-doped titanium oxynitride (TiN x O y ) thin films were grown by atomic layer deposition (ALD) using the TiCl4 precursor, NH3, and O2 at 420 °C. Forming gas was used to reduce the background ...oxygen concentration and to transfer the copper atoms in an ALD chamber prior to the growth initiation of Cu-doped TiN x O y . Such forming gas-mediated Cu-doping of TiN x O y films had a pronounced effect on their resistivity, which dropped from 484 ± 8 to 202 ± 4 μΩ cm, and also on the resistance temperature coefficient (TCR), which decreased from 1000 to 150 ppm °C–1. We explored physical mechanisms causing this reduction by performing comparative analysis of atomic force microscopy, X-ray photoemission spectroscopy, X-ray diffraction, optical spectra, low-temperature transport, and Hall measurement data for the samples grown with and without forming gas doping. The difference in the oxygen concentration between the films did not exceed 6%. Copper segregated to the TiN x O y surface where its concentration reached 0.72%, but its penetration depth was less than 10 nm. Pronounced effects of the copper doping by forming gas included the TiN x O y film crystallite average size decrease from 57–59 to 32–34 nm, considerably finer surface granularity, electron concentration increase from 2.2(3) × 1022 to 3.5(1) × 1022 cm–3, and the electron mobility improvement from 0.56(4) to 0.92(2) cm2 V–1 s–1. The DC resistivity versus temperature R(T) measurements from 4.2 to 300 K showed a Cu-induced phase transition from a disordered to semimetallic state. The resistivity of Cu-doped TiN x O y films decreased with the temperature increase at low temperatures and reached the minimum near T = 50 K revealing signatures of the quantum interference effects similar to 2D Cu thin films, and then, semimetallic behavior was observed at higher temperatures. In TiN x O y films grown without forming gas, the resistivity decreased with the temperature increase as R(T) = – 1.88T 0.6 + 604 μΩ cm with no semimetallic behavior observed. The medium range resistivity and low TCR of Cu-doped TiN x O y make this material an attractive choice for improved matching resistors in RF analog circuits and Si complementary metal–oxide–semiconductor integrated circuits.
Using the Hall effect measurements, it is established that the sign of carriers in the Lu
x
Mn
1–
x
S solid solutions changes upon temperature and concentration variations. The extrema in the ...temperature dependence of the electrical resistance and hysteresis of the electric polarization are found. The change in the sign of the exchange coupling between the nearest neighbors under electron doping is established. The magnetoresistance in the paramagnetic region is caused by the change in the induced electric polarization in a magnetic field.
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