In material testing a great number of castings has to be inspected due to safety reasons. This paper deals with procedures of automatic X-ray inspections of castings in detail. The application of a ...rank operator to the automatic X-ray inspection of castings will be introduced. This rank operator is based on the median filter and it has been optimized towards short execution time, trying to preserve the properties of the median filter as far as possible. It is developed to detect defects of small extension or dendritic structures. An application of direct comparison of a specimen and a reference for the detection of defects with large extension will be shown. Therefore correction of their translatoric displacement by means of the cross-correlation function is necessary.
In recent years, Package on Package (POP) and Bottom Termination Components (BTCs) devices have become very important and widely used in the PCBA manufacturing process. Two of the most challenging ...PCBA process failures are component warpage and HoP defects. Therefore, achieving the best possible solder joint quality becomes an increasingly important consideration for the PCB assemblers. Most of the solder joints of a POP and BTC device are invisible by optical means, so x-ray inspection is the only way to examine the solder quality in a non-destructive way. At the same time, the only method for assessing the warpage and co-planarity issues of the component is 3D AOI. As a consequence, AXI and 3D AOI are more frequently used on the SMT lines. However, both these technologies have certain limitations that may need assistive technologies for the verification of possible false faults.
The silicon-on-silicon (Si-on-Si) multichip module (MCM) is one of the newest system integration technologies that has the potential for high functional integration, enhanced performance, and cost ...effectiveness. Aside from functional tests, X-ray inspection is required to ensure good quality chip-to-chip interconnections during the fabrication process. This paper presents an automated inspection system that is capable of detecting defects such as "swollen" solders, misaligned solders, missing solders, solder robbing, and solder bridging in a semi-finished MCM. The semi-finished MCM is in wafer form and has completed the following operations: stencil printing device placing, and solder reflowing. The defect detection methodology is detailed. Over a test set of 54 sample images of wafer tiles, 100% inspection accuracy was obtained. This system has the potential to automate the manual visual inspection operation which is tedious, slow, and error-prone.< >
IXYS UK Westcode, part of the global power semiconductor manufacturer, IXYS Corp, is investing in its Chippenham, UK, factory to manufacture a new range of power semiconductor devices, which will be ...marketed alongside the company's long-established Press-Pack Capsules (three-terminal power semiconductor devices). Nikon Metrology was chosen to supply the all-important X-ray equipment for checking the quality of the reflow soldering process during production. X-raying is carried out at two stages of manufacture. While the X-ray machine was installed specifically for direct copper bonded inspection, its presence on the Chippenham site has proved beneficial for verifying the quality of bought-in materials. An additional advantage of X-ray technology from Nikon Metrology is the stability of output due to the microfocus spot source and advanced image processing capabilities, essential to avoid degradation of image quality. IXYS UK Westcode's inspection of power semiconductor devices will increase over the coming years.
The 265,000 square feet of office and manufacturing space is the new Product Inspection Headquarters of the Americas and houses all of the Product Inspection business units- Safeline metal detection ...and X-ray inspection, Hi-Speed checkweighing, CI-Vision machine vision and PCE Track&Trace/Serialization. In his new role, Hogue will be responsible for Virginia, North Carolina, South Carolina, Georgia, Florida, Tennessee, Alabama and Mississippi. tna is pleased to announce the appointment of Tom McPhee to the newly created position of group technical support manager, reinforcing the company's commitment to customer service excellence. Based in tna's Dallas office, Tom will be responsible for coordinating and developing tna's growing global technical support teams, including the company's expansive aftermarket service division.
FastBack® 260E-G3 conveyors gently transport product by cycling through slow-forward and fast-back horizontal motion, which neither damages product nor disturbs coatings, while providing the fastest ...product travel rates, maximizing product distribution efficiency. www.heatandcontrol.com Process Expo Booth #2255 JBT Whether you need stand-alone food processing equipment or integrated in-line systems, JBT offers solutions for every stage - from high pressure processing, clipping and packaging, and X-ray inspection, to cooking and freezing - JBT enables companies to maximize efficiency, hygiene and throughput. When working with Rome Grinding Solutions you benefit from in-house engineering capabilities, expertise in CNC machining technology, in-house tin plating, optimized turn-around times, and fast, reliable customer and technical service support. www.romegrindingsolutions.com Process Expo Booth #1624 Ross Industries Ross is well known for its wide range of processing and packaging equipment. Stop by to learn more about the simplicity, precision and performance of these machines and much more. www.UltraSourceUSA.com Process Expo Booth 2649 Unibloc Pump At Unibloc Pump, we are proud to live up to our reputation of providing exceptional craftsmanship and an uncompromising commitment to customer service. Since 1984, Unibloc has provided the food and beverage, meat and poultry, pharmaceutical and more industries with precision-engineered sanitary pumps, strainers and valves to take on the toughest jobs. Since the inception of Unibloc Pump, we've been dedicated to providing uncompromised customer service.
Ensight Solutions, Likwifier Division 816-561-9050 dwolfe@ensightsolutions.us www.ensightsolutions Booth: #1648 Handtmann Inc. IDEAS FOR THE FUTURE The Handtmann booth will be demonstrating award ...winning solutions for dairy as well as meat, pet food and bakery that have been recognized for their automation excellence, technical innovations and hygienic designs, including the specialized VF 800 D filler series for dairy that is in compliance with 3-A Sanitary Standard 23-06. THE POWER OF DATA-DRIVEN PERFORMANCE Handtmann will also highlight HDS Digital Solutions, intelligent customizable planning, monitoring and control system tools for the filling department that also link critical processing information to plant, enterprise or cloud-based process optimization initiatives. Other exhibits include two x-ray inspection systems which identify foreign materials in both piped and bulk applications, and a combination checkweigher and metal detector for unmatched accuracy of weight and metal detection in one compact unit. RELCO, LLC. 320-231-2210 info@relco.net www.relco.net Booth: #660 Unibloc Pump At Unibloc Pump, we are proud to live up to our reputation of providing exceptional craftsmanship and an uncompromising commitment to customer service. Since 1984, Unibloc has provided the food, dairy and beverage, meat and poultry, pharmaceutical and more industries with precision-engineered sanitary pumps, strainers and valves to take on the toughest jobs.
SHOW PREVIEW: PACK EXPO PROFILES
National Provisioner,
08/2019, Letnik:
233, Številka:
8
Magazine Article, Trade Publication Article
CEIA's continuous inspection process accurately differentiates between metal contaminants and product effects. www.heatandcontrol.com Pack Expo Booth #C-1623 JBT Whether you need stand-alone food ...processing equipment or integrated in-line systems, JBT offers solutions for every stage - from high pressure processing, clipping and packaging, and X-ray inspection, to cooking and freezing - JBT enables companies to maximize efficiency, hygiene and throughput. Comply with, and exceed, product safety standards, weight legislation and retailer codes of practice; maximize production uptime; be self-sufficient; and enjoy lower lifetime equipment costs. www.loma.com Pack Expo Booth #C-4103 Multivac Inc. MULTIVAC is a worldwide leading provider of packaging solutions used to pack a range of products, including food products, life science and healthcare products, as well as industrial goods. The new VDG lntelliDrive™ with permanent magnet motor technology and a variable frequency drive integrated inside the motor junction box or i-Controller, provides conveyor drive data feedback and simplifies belt speed selection without loss of torque or belt-pull. www.vandergraaf.com/NP Pack Expo Booth #LS-5984 Watson Marlow Fluid Technology Group Watson-Marlow to Showcase MasoSine Certa Pump at PACK EXPO 2019 The MasoSine Certa pump has been designed to set a new benchmark in clean pumping for food and beverage industry applications. Eye-Flex® metal modular conveyor belt is extremely customizable with many advantages: * Modular Belt Design: Versatile with almost unlimited configurations * Enhanced Belt Strength: Designed with special reinforcing plates to increase strength and belt life * Available Flights: Carries product through an incline/decline If you're looking for a conveyor belt that is easy to install and maintain, look no further Compact-Grid™ conveyor belt: * Quick joining installation * Get up and running fast * Excellent belt tracking * Positive drive sprockets run the belt straight and true * Enhanced Belt Strength * The grid pattern provides increased belt life www.wirebelt.com Pack Expo Booth #US-7160
Embedded components are one of the current trends in electronics, allowing to produce more compact devices with increased functionality. Such components can be applied, among others, in fabrication ...devices used in the Internet‐of‐Things technology or in special industries. Therefore, their reliability plays a key role due to safety requirements and high deployment costs. Herein, the thermal reliability of a system of sensors embedded into a printed circuit board (PCB) is examined. The samples produced are exposed to temperature cycling, −40 °C/+105 °C, or high temperature/high humidity, 85 °C/85% relative humidity (RH). The quality of solder joints is evaluated on the basis of X‐ray inspection and cross sections before and after the exposure mentioned earlier. The tests show no damage to the solder joints of the samples subjected to reliability testing in high‐temperature/high‐humidity conditions, irrespective of the solder alloy used. Cracks appear after 500 cycles, −40 °C/+105 °C, in samples soldered with Sn99Cu1 and after 1000 temperature cycles in both Sn99Cu1 and LFM‐48S (SnAg3.0Cu0.5) solders. The presented results are used for efficient embedding of electronic components into PCBs. Consequently, more space is gained for other components and the size of the electronic products is minimized.
The thermal reliability of a system of sensors embedded into a printed circuit board is examined. The tests show no damage to the solder joints of the samples subjected to 85 °C/85% RH. Cracks appear after 500 cycles, −40 °C/+105 °C, in samples soldered with Sn99Cu1 and after 1000 cycles in Sn99Cu1 and SnAg3.0Cu0.5 solders.
When joining the aluminum alloys, one of the biggest challenges is the formation of porosity, which deteriorates mechanical properties of welds. In this study, the lap welding was conducted on an ...aluminum alloy 5754 metal sheets with a thickness of 2 mm. The effects of various laser welding parameters on the weld quality were investigated. The porosity content was measured by X-ray inspections. The key is to control the solidification duration of molten pool. When the solidification duration of molten pool is large enough, more bubbles can escape from the molten pool and less remain as porosity.
