Using the different test structures, we investigated the Triangular Voltage Sweep (TVS) variables, e.g. temperature, capacitor area & voltage sweep rate to observe the mobile ion in dielectric layer ...for Back-end process. We found that temperature 125°C could activate mobile ions. The amount of mobile ion is strongly correlated with tested topology. The amount of mobile ion is also dependent on the voltage sweep rate. Time-dependent dielectric breakdown (TDDB) lifetime will reduce 1 order when mobile ion concentration raise 1 order. It is extremely important to specify the reasonable dielectric area of test structure (intra-metal comb length) for both of TDDB and TVS.
Marine switchboards are manufactured to specifications similar to industrial switchboards, but sustain arcing faults more frequently. Thus the marine environment can serve as to accelerate aging, ...showing what industrial switchboards will experience over time. US Navy data are used to show that faulty connections are the primary cause of arcing faults in marine switchboards. Various approaches to arc detection and to the prevention of arcing failures will be examined. The approaches which were integrated into an automatic arc fault protection system for the Navy will be discussed. The historical effectiveness of arc fault protection systems on Navy ships will be discussed. The authors believe that the success achieved in this harsh marine environment is statistically significant and holds lessons for the deployment of arc fault protective systems in critical land-based, power distribution systems.
The fabrication of multi-stage depressed collector for space TWTs involve several complexities due to the stringent space constraints imposed. Few common problems encountered are: (1) high voltage ...breakdown problems; (2) large size; (3) bulkier; (4) long fabrication time. In order to counteract these problems, single-ceramic technology has been used in the fabrication of the collector. Due to this, size and weight reduction has been made possible. Further, radial feed-throughs have been used rather than axil feed-throughs, thereby eliminating highvoltage break-down issues. The number of operations involved in the fabrication of the collector has been reduced from fourteen to four, as compared to its conventional multi-ceramic counterpart.
Parametric study of impulse high voltage discharge Berdin, S A; Galchenko, D A; Zagvozdkin, B V ...
2010 5th International Confernce on Ultrawideband and Ultrashort Impulse Signals,
2010-Sept.
Conference Proceeding
Features and results of experimental parametrical study of high-voltage breakdown in dense dielectric media are considered. Influence of temporal characteristics of the test system to breakdown ...parameters of dielectric is shown. Design and performance data of voltage and current sensors together with algorithm for experimental data processing are discussed.
E sınıfı güç yükselteci, anahtar olarak çalışan bir transistör (ya da FET) ve rezonans devresinden oluşmaktadır.Bu yükselteçlerde güç, anahtar olarak çalışan transistörün akım kapasitesine ve çalışma ...gerilimine bağımlıdır. Transistörün dayanma gerilimi, fiziki yapısına bağlı olduğundan, yükseltecin gücünü arttırmak için transistörün dayanabileceği maksimum akım sınırına kadar çıkılmaktadır. Akımın arttırılışı ise, rezonans devresinden dolayı ters indüksiyonun artmasına neden olduğundan, transistörü zorlayan ters gerilim problem oluşturmaktadır. Bu çalışmada, dayanma gerilimi arttırılmış transistör bağlantısının E sınıfı güç yükselteçlerine uygulanması gerçekleştirilmiştir. Bu sayede, transistörü zorlayan ters gerilim problem olmaktan çıkarıldığı gibi, yükseltecin besleme gerilimi iki katına çıkarılarak yükselteç gücü ve verimi arttırılmıştır.
Class-E amplifier consist of a switching device (BJT or FET) and a rezonant circuit. The power of amplifier depends on current and supply voltage of the transistor. The breakdown voltage of the transistor is increased to the maximum level in order to increase the power of the amplifier. Because of increasing the current increases the reverse induction, the reverse voltage creates a problem for the transistor. In this work, the increased breakdown voltage transistor Configuration is applied to class-E power amplifiers. Therefore, the reverse voltage problem is solved and supply voltage.
Morphology studies and current-voltage (IV) measurements of C60 thin film diodes in the temperature range of 300–4.2 K are presented. For defined evaporation parameters orientation domains along the ...growth direction are demonstrated by cross section transmission electron microscopy. From the electrical characterization the fullerene diodes exhibit space charge limited currents which follow a power law dependency. At current densities above 100 mA cm-2 and temperatures below 200 K reversible voltage instabilities (S-shape IV characteristics, negative differential resistance) arise. The instabilities are similar to charge transport effects in amorphous inorganic semiconductors.
It is widely recognized that arcing faults in switchboards contain large amounts of power and can create significant damage including melting switchboards, destroying substations, disabling ships, ...and causing human fatalities. While arcing faults occur with a fairly high frequency, electricity is so ubiquitous in our lives that most engineers are not personally associated with a major arcing fault. The navy has invested twenty five years investigating the causes, behavior, and prevention of arcing failures in low and medium voltage switchboards. Laboratory testing used to help understand the behavior of arcs in switchboards is presented. That data is then used to analyze actual switchboard arcing events and thus to determine the root causes of the events. Additional testing used to confirm the cause of each event is discussed.
An arc fault is the discharge of electricity through the air between two conductors creating large quantities of heat and light. It is widely accepted that there are many variables which affect the ...behavior of an arc in real switchboards and thus understanding the phenomena is difficult. This paper is based upon the results of several years of arc testing with circuits from 155 VDC to three phase 450 VAC and at power levels from tens of kilowatts to several megawatts. The goal of the testing was to understand the general behavior of arcing faults in low voltage switchboards well enough to predict the motion of arcs and to design electronic monitoring systems which are capable of protecting switchboards against arcs. This paper focuses on the arc behavior while our other papers discusses its implications upon forensic investigations and upon the arc fault protective systems.
A study of the effect of thermal aging on the dielectric properties of rectangular magnetic copper wire showed the stability of perfluo-roalkoxy-coated wire against thermal aging and aging in oil, in ...contrast to polyamide-imide-coated enameled copper wire.
