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Ghegin, E.; Nemouchi, F.; Labar, J.; Favier, S.; Perrin, C.; Hoummada, K.; Gurban, S.; Gergaud, P.
2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM), 05/2015Conference Proceeding
The metallurgical properties of the Ni/n-InP system have been investigated. We report the formation of a compositionally nonuniform Ni-In-P amorphous layer during the DC sputtering metal deposition process which includes an Ar + cleaning. After RTP and long in situ annealing treatments the simultaneous appearance of the Ni 2 P and Ni 3 P binary phases and the Ni 2 InP ternary phase were observed. Kinetics and nucleation phenomena were highlighted by the precipitation of In during the RTP.
