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  • Ming-Hung Chen; Tzu-Hsing Chiang; Jia-Hao Zhang; Hsu-Chiang Shih; Sheng-Chi Hsieh; Teck Chong Lee; Chih-Pin Hung

    2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
    Conference Proceeding

    In this paper, a mass production solution of integrated passive device utilized on radio frequency communication systems was proposed through a glass panel platform where the size could be up to 408 mm * 512 mm and provided 1-layer capacitor and 1-layer inductor for IPD design. The structure characterization of panel-based IPD was performed as well as the electrical stability and RF functional test were evaluated to show the capability reference for further applications. The panel-based process could also provide a cost effective solution on emerging production.