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  • Ying-Chen Chen; Yao-Feng Chang; Fowler, Burt; Fei Zhou; Xiaohan Wu; Cheng-Chih Hsieh; Heng-Lu Chang; Chih-Hung Pan; Min-Chen Chen; Kuan-Chang Chang; Tsung-Ming Tsai; Ting-Chang Chang; Lee, Jack C.

    2016 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA), 04/2016
    Conference Proceeding

    Intrinsic unipolar SiOx-based Resistive-RAM (ReRAM) characteristics have been investigated. The cross-bar MIM structures have been examined under AC frequency response, by varying device area, temperature and current states. The results provide additional insights into the hopping/switching mechanisms. For the first time, by using SiOx/HfOx stacking engineering, we have developed a low-voltage operation (<; 2V) for SiOx-based ReRAM. The SiOx/HfOx stacking optimization not only maintains the RS behaviors even in air environment without any programming window degradation, but also further reduces the switching voltage below 2V.