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Wang, Szu-Yu; Lue, Hang-Ting; Du, Pei-Ying; Liao, Chien-Wei; Lai, Erh-Kun; Lai, Sheng-Chi; Yang, Ling-Wu; Yang, Tahone; Chen, Kuang-Chao; Gong, Jeng; Hsieh, Kuang-Yeu; Liu, Rich; Lu, Chih-Yuan
IEEE transactions on device and materials reliability, 06/2008, Letnik: 8, Številka: 2Magazine Article
In this paper, the reliability properties of bandgap-engineered SONOS (BE-SONOS) devices with various processing methods are extensively studied. BE-SONOS employs a multilayer O1/N1/O2/N2/O3 stack, where O1/N1/O2 serves as a bandgap-engineered tunneling barrier that provides an efficient hole-tunneling erase but eliminates the direct-tunneling leakage. BE-SONOS can overcome the fundamental limitation of the conventional SONOS, for which fast erase speed and good data retention cannot be simultaneously achieved. In this paper, a comprehensive understanding of BE-SONOS reliability is reported, including the processing effects of the critical ONO barrier (O1/N1/O2), the trapping layer (N2), and the top blocking oxide (O3). Moreover, the capability of dielectric scaling is also evaluated. Lower P/E voltages, good P/E cycling endurance, and data retention are maintained when N2 and O3 are further scaled to 60 . The results in this paper provide design and processing guidelines for optimizing the performance and reliability of BE-SONOS flash memory devices.
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in: SICRIS
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