E-viri
-
Ju, Byeong-Kwon; Choi, Woo-Beom; Lee, Yun-Hi; Jung, Sung-Jae; Lee, Nam-Yang; Han, Jeong-In; Cho, Kyoung-Ik; Oh, Myung-Hwan
Microelectronics, 11/1998, Letnik: 29, Številka: 11Journal Article
Two ITO-coated glass wafers (Corning #7740, #0080) are successfully bonded by the typical Si-Pyrex electrostatic bonding mechanism. Both Si-#7740 and Ti-(Li-doped SiO2) interlayer systems can be employed for the electrostatic bonding of #7059-#7059 and #0080-#0080 glass wafer pairs. This glass-to-glass electrostatic bonding process can be applied to the clean and tubeless packaging of field emission display panels.
