We report the first measurements of self‐healing polymers with embedded shape‐memory alloy (SMA) wires. The addition of SMA wires shows improvements of healed peak fracture loads by up to a factor of 1.6, approaching the performance of the virgin material. Moreover, the repairs can be achieved with reduced amounts of healing agent. The improvements in performance are due to two main effects: (i) crack closure, which reduces the total crack volume and increases the crack fill factor for a given amount of healing agent and (ii) heating of the healing agent during polymerization, which increases the degree of cure of the polymerized healing agent. The performance of self‐healing polymers is improved by embedding shape‐memory alloy wires and activating them during healing. Increased healing efficiency is achieved by crack closure and heating of the healing agent during polymerization.