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Zhang, J.Y.; Zhang, X.; Wang, R.H.; Lei, S.Y.; Zhang, P.; Niu, J.J.; Liu, G.; Zhang, G.J.; Sun, J.
Acta materialia, 11/2011, Letnik: 59, Številka: 19Journal Article
The plastic deformation and fracture behavior of two different types of Cu/X (X=Nb, Zr) nanostructured multilayered films (NMFs) were systematically investigated over wide ranges of modulation period (λ) and modulation ratio (η, the ratio of X layer thickness to Cu layer thickness). It was found that both the ductility and fracture mode of the NMFs were predominantly related to the constraining effect of ductile Cu layers on microcrack-initiating X layers, which showed a significant length-scale dependence on λ and η. Experimental observations and theoretical analyses also revealed a transition in strengthening mechanism, from single dislocation slip in confined layers to a load-bearing effect, when the Cu layer thickness was reduced to below ∼15nm by either decreasing λ or increasing η. This is due to the intense suppression of dislocation activities in the thin Cu layers, which causes a remarkable reduction in the deformability of the Cu layers. Concomitantly, the constraining effect of Cu layers on microcrack propagation is weakened, which can be used to explain the experimentally observed λ and η-dependent fracture mode transition from shear mode to an opening mode. Furthermore, the fracture toughness of the NMFs is also found to be sensitive to both λ and η. A fracture mechanism-based micromechanical model is developed to quantitatively assess the length-scale-dependent fracture toughness, and these calculations are in good agreement with experimental findings.
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