Depleted Monolithic Active Pixel Sensors (DMAPS) are monolithic pixel detectors with high-resistivity substrates designed for use in high-rate and high-radiation environments. They are produced in ...commercial CMOS processes, resulting in relatively low production costs and short turnaround times, and offer a low material budget. LF-Monopix1 and TJ-Monopix1 are large DMAPS prototypes produced in 150 nm LFoundry and 180 nm TowerJazz technology, respectively, that follow two different design concepts regarding the charge collection electrode. Prototypes of both development lines have been extensively tested and characterized over the last years. The second-generation Monopix prototypes, Monopix2, were recently produced. They were designed to address the shortcomings of their predecessors, in particular related to radiation hardness and cross talk, and further improve upon their performance. The latest measurements with LF-Monopix1 and TJ-Monopix1 concerning hit efficiency, depletion, and radiation hardness as well as the initial test results of the new Monopix2 prototypes are presented.
Prototyping serial powering with RD53A Hinterkeuser, F; Hamer, M; Daas, M ...
Journal of physics. Conference series,
11/2022, Volume:
2374, Issue:
1
Journal Article
Peer reviewed
Open access
The ATLAS inner detector will be replaced by an all-silicon detector for the HL-LHC upgrade around 2025. The innermost five layers of the detector system will be pixel detector layers which will be ...most challenging in terms of radiation hardness, data rate and readout speed. A serial power scheme will be used for the pixel layers to reduce the material budget and power consumption in cables. New elements are required to operate and monitor a serially powered detector including a detector control system, constant current sources and front-end electronics with shunt regulators. Prototypes for all sections of the ITk pixel detector are built to verify the concept and operate multiple serial power chains as a system test. The evaluation of both the readout of multi-modules and mechanical integration are further aims of the prototyping campaign. In the contribution, results will be presented of this prototyping effort. Moreover, details and features of serial powering for full detector systems will be given.
DMAPS Monopix developments in large and small electrode designs Bespin, C.; Barbero, M.; Barrillon, P. ...
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
10/2020, Volume:
978
Journal Article
Peer reviewed
LF-Monopix1 and TJ-Monopix1 are depleted monolithic active pixel sensors (DMAPS) in 150nm LFoundry and 180nm TowerJazz CMOS technologies respectively. They are designed for usage in high-rate and ...high-radiation environments such as the ATLAS Inner Tracker at the High-Luminosity Large Hadron Collider (HL-LHC). Both chips are read out using a column-drain readout architecture. LF-Monopix1 follows a design with large charge collection electrode where readout electronics are placed inside. Generally, this offers a homogeneous electrical field in the sensor and short drift distances. TJ-Monopix1 employs a small charge collection electrode with readout electronics separated from the electrode and an additional n-type implant to achieve full depletion of the sensitive volume. This approach offers a low sensor capacitance and therefore low noise and is typically implemented with small pixel size. Both detectors have been characterized before and after irradiation using lab tests and particle beams.
Front-End electronics and integration of ATLAS pixel modules Hügging, F.
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
09/2005, Volume:
549, Issue:
1
Journal Article
Peer reviewed
For the ATLAS Pixel Detector fast readout electronics has been successfully developed and tested. Main attention was given to the ability to detect small charges in the order of 5,000 e
− within 25
...ns in the harsh radiation environment of LHC together with the challenge to cope with the huge amount of data generated by the 80 million channels of the Pixel detector. For the integration of the 50
μm pitch hybrid pixel detector, reliable bump bonding techniques using either lead-tin or indium bumps has been developed and has been successfully tested for large-scale production.
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