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  • Stable SnAgCu solder joints... Stable SnAgCu solder joints reinforced by nickel-coated carbon fiber for electronic packaging
    Du, Yihui; Ji, Xiaoliang; Lin, Sijia ... Engineering fracture mechanics, 08/2024, Volume: 307
    Journal Article
    Peer reviewed

    •Ni@CF is proven to enhance the stability of solder joints during multiple reflows.•Grain structure evolution of interfacial IMC was studied during multiple reflows.•The shift of the shear fracture ...
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  • Integrated effects of polym... Integrated effects of polymer type, size and shape on the sinking dynamics of biofouled microplastics
    Liu, Siguang; Huang, Yifeng; Luo, Dehua ... Water research (Oxford), 07/2022, Volume: 220
    Journal Article
    Peer reviewed
    Open access

    •Expanded PS granules with 100 μm diameter begin to sink after 2 weeks of biofouling.•The sinking onset of PE and PP granules are similar and earlier than EPS granules.•Smaller MPs sinking faster is ...
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  • Recent advances in the role... Recent advances in the roles of minerals for enhanced microbial extracellular electron transfer
    Dong, Guowen; Chen, Yibin; Yan, Zhiying ... Renewable & sustainable energy reviews, December 2020, 2020-12-00, Volume: 134
    Journal Article
    Peer reviewed
    Open access

    Minerals are ubiquitous in the natural environment and have close contact with microorganisms. In various scenarios, microorganisms that harbor extracellular electron transfer (EET) capabilities have ...
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34.
  • Microplastic pollution char... Microplastic pollution characteristics and its future perspectives in the Tibetan Plateau
    Wang, Ting; Qu, Liyin; Luo, Dehua ... Journal of hazardous materials, 09/2023, Volume: 457
    Journal Article
    Peer reviewed
    Open access

    Microplastics are an emerging and persistent pollutant due to their threat to global ecological systems and human health. Recent studies showed that microplastics have infiltrated the remote Third ...
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  • Revealing the ductile-to-br... Revealing the ductile-to-brittle transition mechanism in polycrystalline body-centered tetragonal tin (Sn) for cryogenic electronics
    Ji, Xiaoliang; An, Rong; Zhou, Wei ... Journal of alloys and compounds, 05/2022, Volume: 903
    Journal Article
    Peer reviewed

    The inherent ductile-to-brittle transition (DBT) of body-centered tetragonal Sn at cryogenic temperatures restricts the use of Sn-based solders in the interconnection of cryogenic electronics, but ...
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  • Synthesis of Substituted Th... Synthesis of Substituted Thiophenes through Dehydration and Heterocyclization of Alkynols
    Li, Jian; Liu, Yang; Chen, Zebin ... Journal of organic chemistry, 03/2022, Volume: 87, Issue: 5
    Journal Article
    Peer reviewed

    A protocol was described for obtaining a variety of substituted thiophenes with functional potential via metal-free dehydration and sulfur cyclization of alkynols with elemental sulfur (S8) or ...
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  • Cadmium sulfide nanoparticl... Cadmium sulfide nanoparticles-assisted intimate coupling of microbial and photoelectrochemical processes: Mechanisms and environmental applications
    Dong, Guowen; Wang, Honghui; Yan, Zhiying ... The Science of the total environment, 10/2020, Volume: 740
    Journal Article
    Peer reviewed
    Open access

    Intimate coupling of microbial extracellular electron transfer (EET) and photoelectrochemical processes is an emerging research area with great potential to circumvent many disadvantages associated ...
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  • Comprehensive evaluation of... Comprehensive evaluation of Dendrobium officinale from different geographical origins using near-infrared spectroscopy and chemometrics
    Yang, Yue; She, Xiangting; Cao, Xiaoqing ... Spectrochimica acta. Part A, Molecular and biomolecular spectroscopy, 09/2022, Volume: 277
    Journal Article
    Peer reviewed

    Display omitted •NIR provides a comprehensive method for quality evaluation of Dendrobium officinale.•Rapid content determination and origin identification was performed.•CARS algorithm was ...
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  • TEM and EBSD characterizati... TEM and EBSD characterization revealing the recrystallization process occurring in the Sn-3.0Ag-0.5Cu Ball Grid Array solder joints during thermal cycling
    Du, Yihui; Wang, Yishu; Ji, Xiaoliang ... Materials characterization, June 2023, 2023-06-00, Volume: 200
    Journal Article
    Peer reviewed

    We reported a phenomenon and mechanism of recrystallization evolution in solder joint under thermo-mechanical stress. Ball Grid Array samples fabricated by Sn3.0Ag0.5Cu solder were placed into the ...
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  • Transition Metal‐Free Synth... Transition Metal‐Free Synthesis of Substituted Isothiazoles via Three‐Component Annulation of Alkynones, Xanthate and NH4I
    Li, Jian; Li, Jiaming; Ji, Xiaoliang ... Advanced synthesis & catalysis, February 16, 2021, Volume: 363, Issue: 4
    Journal Article
    Peer reviewed

    A protocol was described to access diverse isothiazoles with functionalization potential via transition metal‐free three‐component annulation of alkynones, potassium ethylxanthate (EtOCS2K) and ...
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