Minimisation of electronics requires increased cooling capacity, and research on heat pipes packed with nanofluid is ongoing. In the open literature, comparative study in heat pipe performance and nanofluid stability has attracted much attention. A cylindrical-shaped heat pipe with a copper screen mesh typed wick construction is improved using new experimental data for water-based nanofluids. Al 2 O 3 (Aluminum Oxide), CuO (Copper Oxide), and ZnO (Zinc Oxide) nanoparticles have been dispersed to the base fluid at a concentration of 1.0 wt %t. The influence of several nanofluids on heat transfer capabilities of heat pipes was compared with the experimental results, especially in the context of heat load (continued to rise in a range of 60-160W with a 20 W distinction) and inclination angle (fluctuated from 0° to 90° with a 15° difference). At a 60° angle, the CuO nanoparticles dispersed nanofluids showed higher thermal enhancement than other working media. Compared to Al 2 O 3 /DI water, ZnO/DI water, and based fluid, the retardation in the form of thermal resistance for CuO/DI water was 27.51%t, 36.21%t, and 57.58%t, respectively. Furthermore, increased heat load causes a delay in thermal enrichment.