The MALTA monolithic silicon pixel sensors have been used to study dicing and thinning of monolithic silicon pixel detectors for large area and low mass modules. Dicing as close as possible to the active circuitry will allow to build modules with very narrow inactive regions between the sensors. Inactive edge regions of less than 5μ m to the electronic circuitry could be achieved for 100μm thick sensors. The MALTA chip (Cardella et al., 2019) also offers the possibility to transfer data and power directly from chip to chip. Tests have been carried out connecting two MALTA chips directly using ultrasonic wedge wire bonding. Results from lab tests show that the data accumulated in one chip can be transferred via the second chip to the readout system, without the need of a flexible circuit to route the signals. The concept of chip to chip data and power transfer to achieve low mass modules has also been studied on prototype wafers using Cu-stud interconnection bridges. First results are presented, outlining technical challenges and possible future steps to achieve a low mass large area monolithic pixel sensor module.