The INFN–FBK “Phase-2” R&D program Dalla Betta, G.-F.; Boscardin, M.; Bomben, M. ...
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
07/2016, Letnik:
824
Journal Article
Recenzirano
Odprti dostop
We report on the 3-year INFN ATLAS–CMS joint research activity in collaboration with FBK, started in 2014, and aimed at the development of new thin pixel detectors for the High Luminosity LHC Phase-2 ...upgrades. The program is concerned with both 3D and planar active-edge pixel sensors to be made on 6” p-type wafers. The technology and the design will be optimized and qualified for extreme radiation hardness (2×1016neqcm−2). Pixel layouts compatible with present (for testing) and future (RD53 65nm) front-end chips of ATLAS and CMS are considered. The paper covers the main aspects of the research program, from the sensor design and fabrication technology, to the results of initial tests performed on the first prototypes.
INFN-FBK developments of 3D sensors for High-Luminosity LHC Oide, H.; Alimonti, G.; Boscardin, M. ...
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
04/2019, Letnik:
924
Journal Article
Recenzirano
3D type of pixel sensors is a promising option for the innermost pixel layer at the High-Luminosity LHC. However, the required very high hit-rate capabilities, finer pixel granularity, extreme ...radiation hardness and reduced material budget call for a downscale of the pixel size as compared to existing 3D sensors, involving smaller pitch (e.g. 50 × 50 or 25×100μm2), shorter inter-electrode spacing (∼30μm), narrower electrodes (∼6μm diameter), and reduced active thickness (∼100–150μm). Within a joint R&D effort with INFN, FBK has produced a new generation of 3D pixel sensors with these challenging features. In this talk preliminary results from the electrical and functional characterisation of the first prototypes are reported, included their behaviour after large radiation fluence, close to the ones expected in the High Luminosity LHC environment. Prospects for the next prototypes are also presented.
The ATLAS silicon pixel sensors Alam, M.S; Ciocio, A; Einsweiler, K ...
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
01/2001, Letnik:
456, Številka:
3
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Prototype sensors for the ATLAS silicon pixel detector have been developed. The design of the sensors is guided by the need to operate them in the severe LHC radiation environment at up to several ...hundred volts while maintaining a good signal-to-noise ratio, small cell size, and minimal multiple scattering. The ability to be operated under full bias for electrical characterization prior to attachment of the readout integrated circuit electronics is also desired.
MCC: the Module Controller Chip for the ATLAS Pixel Detector Beccherle, R; Darbo, G; Gagliardi, G ...
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
10/2002, Letnik:
492, Številka:
1
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In this article we describe the architecture of the Module Controller Chip for the ATLAS Pixel Detector. The project started in 1997 with the definition of the system specifications. A first ...fully-working rad-soft prototype was designed in 1998, while a radiation hard version was submitted in 2000. The 1998 version was used to build pixel detector modules. Results from those modules and from the simulated performance in ATLAS are reported. In the article we also describe the hardware/software tools developed to test the MCC performance at the LHC event rate.
The High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC) calls for new high radiation-tolerant solid-state pixel sensors, capable of surviving irradiation fluences up to a few 1 0 16 n ...eq /cm 2 at ~ 3 cm from the interaction point. The INFN ATLAS-CMS joint research activity, in collaboration with Fondazione Bruno Kessler, is aiming at the development of thin n + on p type pixel sensors to be operated at the HL-LHC. The R&D covers both planar and 3D pixel devices made on substrates obtained by the Direct Wafer Bonding technique. The active thickness of the planar sensors studied in this paper is 100 μ m or 130 μ m , that of 3D sensors 130 μ m . First prototypes of hybrid modules, bump-bonded to the present CMS readout chips (PSI46 digital), have been characterized in beam tests. Finally, first results on their performance before and after irradiation up to a maximum fluence of ~ 5 × 1 0 15 n eq /cm 2 are reported in this article.
The High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC) calls for new high radiation-tolerant solid-state pixel sensors, capable of surviving irradiation fluences up to a few ...1016neq/cm2 at ∼3cm from the interaction point. The INFN ATLAS-CMS joint research activity, in collaboration with Fondazione Bruno Kessler, is aiming at the development of thin n+ on p type pixel sensors to be operated at the HL-LHC. The R&D covers both planar and 3D pixel devices made on substrates obtained by the Direct Wafer Bonding technique. The active thickness of the planar sensors studied in this paper is 100μm or 130μm, that of 3D sensors 130μm. First prototypes of hybrid modules, bump-bonded to the present CMS readout chips (PSI46 digital), have been characterized in beam tests. First results on their performance before and after irradiation up to a maximum fluence of ∼5×1015neq/cm2 are reported in this article.
The INFN-FBK pixel R&D program for HL-LHC Meschini, M.; Dalla Betta, G.F.; Boscardin, M. ...
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
09/2016, Letnik:
831
Journal Article
Recenzirano
Odprti dostop
We report on the ATLAS and CMS joint research activity, which is aiming at the development of new, thin silicon pixel detectors for the Large Hadron Collider Phase-2 detector upgrades. This R&D is ...performed under special agreement between Istituto Nazionale di Fisica Nucleare and FBK foundation (Trento, Italy). New generations of 3D and planar pixel sensors with active edges are being developed in the R&D project, and will be fabricated at FBK. A first planar pixel batch, which was produced by the end of year 2014, will be described in this paper. First clean room measurement results on planar sensors obtained before and after neutron irradiation will be presented.
The tracking detector of ATLAS, one of the experiments at the Large Hadron Collider (LHC), will be upgraded in 2024–2026 to cope with the challenging environment conditions of the High Luminosity LHC ...(HL-LHC). The LPNHE, in collaboration with FBK and INFN, has produced 130μm thick n−on−p silicon pixel sensors which can withstand the expected large particle fluences at HL-LHC, while delivering data at high rate with excellent hit efficiency. Such sensors were tested in beam before and after irradiation both at CERN-SPS and at DESY, and their performance are presented in this paper. Beam test data indicate that these detectors are suited for all the layers where planar sensors are foreseen in the future ATLAS tracker: hit-efficiency is greater than 97% for fluences of Φ≲7×1015neq∕cm2 and module power consumption is within the specified limits. Moreover, at a fluence of Φ=1.3×1016neq∕cm2, hit-efficiency is still as high as 88% and charge collection efficiency is about 30%.
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