The ATLAS pixel detector Gemme, C.
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
03/2003, Letnik:
501, Številka:
1
Journal Article
Recenzirano
The ATLAS experiment will use a pixel detector as the innermost part of its semiconductor tracker. The pixel detector consists of three cylindrical layers in the barrel part and three disks in the ...forward and backward parts. The detector is designed to operate with a
40
MHz
bunch crossing frequency, a high particle flux density and an extreme radiation environment at LHC. The main characteristics of the project are illustrated together with recent experimental results.
Test beam results of 3D silicon pixel sensors for the ATLAS upgrade Grenier, P.; Alimonti, G.; Barbero, M. ...
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
05/2011, Letnik:
638, Številka:
1
Journal Article
Recenzirano
Odprti dostop
Results on beam tests of 3D silicon pixel sensors aimed at the ATLAS Insertable B-Layer and High Luminosity LHC (HL-LHC) upgrades are presented. Measurements include charge collection, tracking ...efficiency and charge sharing between pixel cells, as a function of track incident angle, and were performed with and without a 1.6
T magnetic field oriented as the ATLAS inner detector solenoid field. Sensors were bump-bonded to the front-end chip currently used in the ATLAS pixel detector. Full 3D sensors, with electrodes penetrating through the entire wafer thickness and active edge, and double-sided 3D sensors with partially overlapping bias and read-out electrodes were tested and showed comparable performance.
In this paper we discuss results relevant to 3D Double-Side Double Type Column (3D-DDTC) pixel sensors fabricated at FBK (Trento, Italy) and oriented to the ATLAS upgrade. Some assemblies of these ...sensors featuring different columnar electrode configurations (2, 3, or 4 columns per pixel) and coupled to the ATLAS FEI3 read-out chip were irradiated up to large proton fluences and tested in laboratory with radioactive sources. In spite of the non-optimized columnar electrode overlap, sensors exhibit reasonably good charge collection properties up to an irradiation fluence of 2×1015neqcm−2, while requiring bias voltages in the order of 100V. Sensor operation is further investigated by means of TCAD simulations which can effectively explain the basic mechanisms responsible for charge loss after irradiation.
3D-FBK pixel sensors: Recent beam tests results with irradiated devices Micelli, A.; Helle, K.; Sandaker, H. ...
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
09/2011, Letnik:
650, Številka:
1
Journal Article
Recenzirano
Odprti dostop
The Pixel Detector is the innermost part of the ATLAS experiment tracking device at the Large Hadron Collider, and plays a key role in the reconstruction of the primary vertices from the collisions ...and secondary vertices produced by short-lived particles. To cope with the high level of radiation produced during the collider operation, it is planned to add to the present three layers of silicon pixel sensors which constitute the Pixel Detector, an additional layer (Insertable B-Layer, or IBL) of sensors. 3D silicon sensors are one of the technologies which are under study for the IBL. 3D silicon technology is an innovative combination of very-large-scale integration and Micro-Electro-Mechanical-Systems where electrodes are fabricated inside the silicon bulk instead of being implanted on the wafer surfaces. 3D sensors, with electrodes fully or partially penetrating the silicon substrate, are currently fabricated at different processing facilities in Europe and USA. This paper reports on the 2010 June beam test results for irradiated 3D devices produced at FBK (Trento, Italy). The performance of these devices, all bump-bonded with the ATLAS pixel FE-I3 read-out chip, is compared to that observed before irradiation in a previous beam test.
3D silicon pixel sensors: Recent test beam results Hansson, P.; Balbuena, J.; Barrera, C. ...
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
02/2011, Letnik:
628, Številka:
1
Journal Article
Recenzirano
The 3D silicon sensors aimed for the ATLAS pixel detector upgrade have been tested with a high energy pion beam at the CERN SPS in 2009. Two types of sensor layouts were tested: full-3D assemblies ...fabricated in Stanford, where the electrodes penetrate the entire silicon wafer thickness, and modified-3D assemblies fabricated at FBK-irst with partially overlapping electrodes. In both cases three read-out electrodes are ganged together to form pixels of dimension
50
×
400
μ
m
2
. Data on the pulse height distribution, tracking efficiency and resolution were collected for various particle incident angles, with and without a 1.6
T magnetic field. Data from a planar sensor of the type presently used in the ATLAS detector were used at the same time to give comparison.
The ATLAS detector community is entering in the final stages of sensor development for the future upgrade of the Large Hadron Collider (LHC). An increase by an order of magnitude of the LHC ...luminosity, up to 1035 cm−2s−1, will lead to an increased radiation dose delivered to the detector, especially for the devices located in the Inner Tracker. In 2018, an experimental study of the damages induced by a beam-loss over silicon strip detectors was done in the High-Radiation to Materials facility at CERN. A progressive number of proton bunches was extracted from the CERN Super Proton Synchrotron, and focused directly over the strip sensor, in order to emulate the large amount of charge typically generated in a beam-loss failure. This work presents the results obtained during this experiment, showing that Punch-Through Protection effectively protects the AC-coupling capacitors of the silicon sensors from large charge accumulations, but still this scenario could induce damages on the read-out electronics.
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