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  • Challenges in packaging a 4... Challenges in packaging a 4 chip FC MCM-L using KGD
    Adamjee, W.; Corona, C.; Czamowski, J.M. ... 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206), 1998
    Conference Proceeding, Journal Article

    The FC MCM-L (Flip Chip MultiChip Module on Laminate) product is comprised of four Known Good Die (KGD) on 25/spl times/25 mm laminate substrate with solder clad bond pads. The FC MCM-L package was ...
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