We are investigating the feasibility of using CMOS foundries to fabricate silicon detectors, both for pixels and for large-area strip sensors. The availability of multi-layer routing will provide the ...freedom to optimize the sensor geometry and the performance, with biasing structures in poly-silicon layers and MIM-capacitors allowing for AC coupling. A prototyping production of strip test-structures and RD53A compatible pixel sensors was recently completed at LFoundry in a 150\(\,\)nm CMOS process. This paper will focus on the characterization of irradiated and non-irradiated pixel modules, composed by a CMOS passive sensor interconnected to a RD53A chip. The sensors are designed with a pixel cell of \(25\times100\,\mu \mathrm{m}^2\) in case of DC coupled devices and \(50\times50\,\mu \mathrm{m}^2\) for the AC coupled ones. Their performance in terms of charge collection, position resolution, and hit efficiency was studied with measurements performed in the laboratory and with beam tests. The RD53A modules with LFoundry silicon sensors were irradiated to fluences up to \(1.0\times10^{16}\,\frac{\mathrm{n}_\mathrm{eq}}{\mathrm{cm}^2}\).
The Compact Muon Solenoid (CMS) experiment is operating at the Large Hadron Collider (LHC) with proton-proton collisions at 13-TeV center-of-mass energy and at a bunch spacing of 25 ns. Challenging ...running conditions for CMS are expected after the High-Luminosity upgrade of the LHC (HL-LHC). We review the CMS ECAL crystal calorimeter upgrade and present results from the first test beam studies. Particular challenges at HL-LHC are the harsh radiation environment, the increasing data rates, and the extreme level of pile-up events, with up to 200 simultaneous proton-proton collisions. Precision timing can be exploited to reduce the effect of the pileup. We report on the timing resolution studies performed with test beams. We discuss the new readout and trigger electronics, which must be upgraded due to the increased trigger and latency requirements at the HL-LHC.
The first observation of $\tau$ lepton pair production in ultraperipheral
nucleus-nucleus collisions, a pure quantum electrodynamics (QED) process, is
presented. The measurement is based on a data ...sample collected by the CMS
experiment at a per nucleon center-of-mass energy of $5.02~\mathrm{TeV}$, and
corresponding to an integrated luminosity of $404~\mu\mathrm{b}^{-1}$. The
$\gamma\gamma\to\tau^{+}\tau^{-}$ production is observed with a statistical
significance of at least five standard deviations for $\tau^{+}\tau^{-}$ events
with a muon and three charged hadrons in the final state. The cross section is
measured in a fiducial phase space region, and is found to be
$\sigma(\gamma\gamma\to\tau^{+}\tau^{-}) = 4.8\pm 0.6\,(\mathrm{stat})\pm
0.5\,(\mathrm{syst})~\mu\mathrm{b}$, in agreement with leading-order QED
predictions. The measurement, based on a small fraction of the expected
integrated luminosity of the LHC nuclear program, establishes the potential for
a substantially more precise determination of the anomalous magnetic moment of
the $\tau$ lepton, which is currently poorly constrained.
Both the current upgrades to accelerator-based HEP detectors (e.g. ATLAS, CMS) and also future projects (e.g. CEPC, FCC) feature large-area silicon-based tracking detectors. We are investigating the ...feasibility of using CMOS foundries to fabricate silicon radiation detectors, both for pixels and for large-area strip sensors. A successful proof of concept would open the market potential of CMOS foundries to the HEP community, which would be most beneficial in terms of availability, throughput and cost. In addition, the availability of multi-layer routing of signals will provide the freedom to optimize the sensor geometry and the performance, with biasing structures implemented in poly-silicon layers and MIM-capacitors allowing for AC coupling. A prototyping production of strip test structures and RD53A compatible pixel sensors was recently completed at LFoundry in a 150nm CMOS process. This presentation will focus on the characterization of pixel modules, studying the performance in terms of charge collection, position resolution and hit efficiency with measurements performed in the laboratory and with beam tests. We will report on the investigation of RD53A modules with 25x100 μm
2
cell geometry.
The first observation of \(\tau\) lepton pair production in ultraperipheral nucleus-nucleus collisions, a pure quantum electrodynamics (QED) process, is presented. The measurement is based on a data ...sample collected by the CMS experiment at a per nucleon center-of-mass energy of \(5.02~\mathrm{TeV}\), and corresponding to an integrated luminosity of \(404~\mu\mathrm{b}^{-1}\). The \(\gamma\gamma\to\tau^{+}\tau^{-}\) production is observed with a statistical significance of at least five standard deviations for \(\tau^{+}\tau^{-}\) events with a muon and three charged hadrons in the final state. The cross section is measured in a fiducial phase space region, and is found to be \(\sigma(\gamma\gamma\to\tau^{+}\tau^{-}) = 4.8\pm 0.6\,(\mathrm{stat})\pm 0.5\,(\mathrm{syst})~\mu\mathrm{b}\), in agreement with leading-order QED predictions. The measurement, based on a small fraction of the expected integrated luminosity of the LHC nuclear program, establishes the potential for a substantially more precise determination of the anomalous magnetic moment of the \(\tau\) lepton, which is currently poorly constrained.
Both the current upgrades to accelerator-based HEP detectors (e.g. ATLAS, CMS) and also future projects (e.g. CEPC, FCC) feature large-area silicon-based tracking detectors. We are investigating the ...feasibility of using CMOS foundries to fabricate silicon radiation detectors, both for pixels and for large-area strip sensors. A successful proof of concept would open the market potential of CMOS foundries to the HEP community, which would be most beneficial in terms of availability, throughput and cost. In addition, the availability of multi-layer routing of signals will provide the freedom to optimize the sensor geometry and the performance, with biasing structures implemented in poly-silicon layers and MIM-capacitors allowing for AC coupling. A prototyping production of strip test structures and RD53A compatible pixel sensors was recently completed at LFoundry in a 150nm CMOS process. This presentation will focus on the characterization of pixel modules, studying the performance in terms of charge collection, position resolution and hit efficiency with measurements performed in the laboratory and with beam tests. We will report on the investigation of RD53A modules with 25x100 mu^2 cell geometry.
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