We identify two engineering solutions to mitigate light-induced degradation (LID) in p-type multicrystalline silicon passivated emitter and rear cells, including modification of metallization firing ...temperature and wafer quality. Lifetime measurements on etched-back samples confirm that LID has a strong bulk component. Spatially resolved lifetime maps indicate that the defects responsible for LID are dispersed ubiquitously across the wafer. Reversibility of LID upon low-temperature annealing suggests a low-activation-energy barrier inconsistent with precipitated impurity dissolution. Lifetime spectroscopy of the LID-affected state reveals an asymmetry of electron and hole capture cross sections of ~28.5, consistent with a deep-level donor point defect (e.g., interstitial Ti, interstitial Mo, substitutional W), charged nanoprecipitate, or charged structural defect, such as a dislocation. Finally, we explain two possible root causes of this LID, including 1) a point-defect complex involving a hydrogen atom and a deep-level donor and 2) configurational change of a point-defect complex involving fast-diffusing impurities.
When untreated, light-induced degradation (LID) of p-type multicrystalline silicon (mc-Si)-based passivated emitter and rear cell (PERC) modules can reduce power output by up to 10% relative during ...sun-soaking under open-circuit conditions. Identifying the root cause of this form of LID has been the subject of several recent investigations. Lifetime spectroscopy analysis, including both injection and temperature dependencies (IDLS and TIDLS), may offer insight into the root-cause defect(s). In this paper, to illustrate the root-case defect identification method, we apply room-temperature IDLS to intentionally Cr-contaminated mc-Si. Then, we apply this technique to the p-type mc-Si that exhibits LID in PERC devices, and we provide further insights by analyzing qualitatively the injection-dependent lifetime as a function of temperature. We quantify the sensitivity of the capture cross-section ratio to variations in the measured lifetime curve and in the surface recombination. We find that the responsible defect most likely has an energy level between 0.3 and 0.7 eV above the valence band and a capture cross-section ratio between 26 and 36. Additionally, we calculate the concentrations of several candidate impurities that may cause the degradation.
While sputtering has been shown to be capable of depositing aluminum oxide suitable for surface passivation, the mechanisms for this are yet to be firmly established and its potential realized. In ...this paper, we investigate the relationships between the oxygen in the sputtering process to the resulting composition of the deposited film and the surface passivation obtained. We find that surface passivation is not strongly dependent on the bulk composition of the film. Instead the results indicate that the interfacial silicon oxide layer that forms after annealing between the aluminum oxide film and the silicon is a much more important factor; it is this combined structure of aluminum oxide, silicon oxide and silicon that is crucial for obtaining negative charges and excellent surface passivation.
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