A powerful and robust control system is a crucial, often neglected, pillar of any modern, complex physics experiment that requires the management of a multitude of different devices and their precise ...time synchronisation. The AEḡIS collaboration presents CIRCUS, a novel, autonomous control system optimised for time-critical experiments such as those at CERN’s Antiproton Decelerator and, more broadly, in atomic and quantum physics research. Its setup is based on Sinara/ARTIQ and TALOS, integrating the ALPACA analysis pipeline, the last two developed entirely in AEḡIS. It is suitable for strict synchronicity requirements and repeatable, automated operation of experiments, culminating in autonomous parameter optimisation via feedback from real-time data analysis. CIRCUS has been successfully deployed and tested in AEḡIS; being experiment-agnostic and released open-source, other experiments can leverage its capabilities.
The goal of the AEgIS experiment is to measure the gravitational acceleration of antihydrogen - the simplest atom consisting entirely of antimatter - with the ultimate precision of 1%. We plan to ...verify the Weak Equivalence Principle (WEP), one of the fundamental laws of nature, with an antimatter beam. The experiment consists of a positron accumulator, an antiproton trap and a Stark accelerator in a solenoidal magnetic field to form and accelerate a pulsed beam of antihydrogen atoms towards a free-fall detector. The antihydrogen beam passes through a moiré deflectometer to measure the vertical displacement due to the gravitational force. A position and time sensitive hybrid detector registers the annihilation points of the antihydrogen atoms and their time-of-flight. The detection principle has been successfully tested with antiprotons and a miniature moiré deflectometer coupled to a nuclear emulsion detector.
Overview of the ATLAS Insertable B-Layer (IBL) Project Røhne, O.
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
12/2013, Letnik:
731
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The upgrades for the ATLAS Pixel Detector will be staged in preparation for high luminosity LHC. The first upgrade for the Pixel Detector is the construction of a new pixel layer which will be ...installed during the first shutdown of the LHC machine, in 2013–2014. The new detector, called the Insertable B-Layer (IBL), will be installed between the existing Pixel Detector and a new, smaller radius beam-pipe at a radius of 3.3cm. The IBL has required the development of several new technologies to cope with increased radiation and pixel occupancy and also to improve the physics performance through reduction of the pixel size and a more stringent material budget. The IBL presents several changes to the design of the present ATLAS Pixel Detector: two different and promising silicon sensor technologies, planar n-in-n and 3D, will be used for the IBL. A new read-out chip FE-I4 has been designed in 130nm technology, the material budget is minimized by using new lightweight mechanical support materials and a CO2 based cooling system has been developed. An overview of the IBL project, of the module design and the qualification for these sensor technologies with particular emphasis on irradiation and beam tests will be presented.
3D-FBK pixel sensors: Recent beam tests results with irradiated devices Micelli, A.; Helle, K.; Sandaker, H. ...
Nuclear instruments & methods in physics research. Section A, Accelerators, spectrometers, detectors and associated equipment,
09/2011, Letnik:
650, Številka:
1
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The Pixel Detector is the innermost part of the ATLAS experiment tracking device at the Large Hadron Collider, and plays a key role in the reconstruction of the primary vertices from the collisions ...and secondary vertices produced by short-lived particles. To cope with the high level of radiation produced during the collider operation, it is planned to add to the present three layers of silicon pixel sensors which constitute the Pixel Detector, an additional layer (Insertable B-Layer, or IBL) of sensors. 3D silicon sensors are one of the technologies which are under study for the IBL. 3D silicon technology is an innovative combination of very-large-scale integration and Micro-Electro-Mechanical-Systems where electrodes are fabricated inside the silicon bulk instead of being implanted on the wafer surfaces. 3D sensors, with electrodes fully or partially penetrating the silicon substrate, are currently fabricated at different processing facilities in Europe and USA. This paper reports on the 2010 June beam test results for irradiated 3D devices produced at FBK (Trento, Italy). The performance of these devices, all bump-bonded with the ATLAS pixel FE-I3 read-out chip, is compared to that observed before irradiation in a previous beam test.
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