Plasmonics is a field uniquely driven by advances in micro‐ and nanofabrication. Many design ideas pose significant challenges in their experimental realization and test the limits of modern ...fabrication techniques. Here, the combination of electron‐beam and gold ion‐beam lithography is introduced as an alternative and highly versatile route for the fabrication of complex and high fidelity plasmonic nanostructures. The capability of this strategy is demonstrated on a selection of planar as well as 3D nanostructures. Large area and extremely accurate structures are presented with little to no defects and errors. These structures exhibit exceptional quality in shape fidelity and alignment precision. The combination of the two techniques makes full use of their complementary capabilities for the realization of complex plasmonic structures with superior optical properties and functionalities as well as ultra‐distinct spectral features which will find wide application in plasmonics, nanooptics, metasurfaces, plasmonic sensing, and similar areas.
The combination of electron‐beam and gold ion‐beam lithography as an alternative and highly versatile route for the fabrication of complex and high fidelity plasmonic nanostructures is introduced. The combination of the two techniques makes full use of their complementary capabilities, which is demonstrated on a selection of planar and 3D nanostructures with superior optical properties and ultra‐distinct spectral features.
DAMO Chen, Guojin; Chen, Wanli; Ma, Yuzhe ...
2020 IEEE/ACM International Conference On Computer Aided Design (ICCAD),
11/2020
Conference Proceeding
Odprti dostop
Continuous scaling of the VLSI system leaves a great challenge on manufacturing, thus optical proximity correction (OPC) is widely applied in conventional design flow for manufacturability ...optimization. Traditional techniques conduct OPC by leveraging a lithography model but may suffer from prohibitive computational overhead. In addition, most of them focus on optimizing a single and local clip instead of addressing how to tackle the full-chip scale. In this paper, we present DAMO, a high performance and scalable deep learning-enabled OPC system for full-chip scale. It is an end-to-end mask optimization paradigm that contains a deep lithography simulator (DLS) for lithography modeling and a deep mask generator (DMG) for mask pattern generation. Moreover, a novel layout splitting algorithm customized for DAMO is proposed to handle full-chip OPC problem. Extensive experiments show that DAMO outperforms state-of-the-art OPC solutions in both academia and industrial commercial toolkit.
A novel and versatile shape memory ink system allowing 4D printing with light at the macroscale as well as the microscale is presented. Digital light processing (DLP) and direct laser writing (DLW) ...are selected as suitable 3D printing technologies to cover both regimes. First, a system based on monofunctional isobornyl acrylate and two crosslinkers consisting of a soft and a hard diacrylate is identified and proven to be compatible with both printing techniques. Employing DLP, a large variety of structures exhibiting distinct complexity is printed. These structures range from simple frames to more demanding 3D geometries such as double platform structures, infinity rings, or cubic grids. The shape memory effect is demonstrated for all the 3D geometries. Excellent shape fixity as well as recovery and repeatability is shown. Furthermore, the formulation is adapted for fast 4D printing at the microscale using DLW. Importantly, the 4D printed microstructures display remarkable shape memory properties. The possibility of trapping and releasing microobjects, such as microspheres, is ultimately demonstrated by designing, smart box‐like 4D microstructures that can be thermally actuated—evidencing the versatility and potential of the reported system.
A simple and versatile ink system is successfully applied for 4D printing at the macro‐ and microscale. The same 3D geometry can be successfully printed in both size regimes using digital light processing and direct laser writing. Both, the macro‐ and microstructure, exhibit excellent shape memory properties.
We report on a highly compact, one diode–one resistor (1D–1R) nanopillar device architecture for SiO x -based ReRAM fabricated using nanosphere lithography (NSL). The intrinsic SiO x -based resistive ...switching element and Si diode are self-aligned on an epitaxial silicon wafer using NSL and a deep-Si-etch process without conventional photolithography. AC-pulse response in 50 ns regime, multibit operation, and good reliability are demonstrated. The NSL process provides a fast and economical approach to large-scale patterning of high-density 1D–1R ReRAM with good potential for use in future applications.
Fabrication of functionalized 3D architected materials is achieved by a facile method using functionalized acrylates synthesized via thiol‐Michael addition, which are then polymerized using ...two‐photon lithography. A wide variety of functional groups can be attached, from Boc‐protected amines to fluoroalkanes. Modification of surface wetting properties and conjugation with fluorescent tags are demonstrated to highlight the potential applications of this technique.
Advances in Nanoimprint Lithography Traub, Matthew C; Longsine, Whitney; Truskett, Van N
Annual review of chemical and biomolecular engineering,
06/2016, Letnik:
7, Številka:
1
Journal Article
Recenzirano
Nanoimprint lithography (NIL), a molding process, can replicate features <10 nm over large areas with long-range order. We describe the early development and fundamental principles underlying the two ...most commonly used types of NIL, thermal and UV, and contrast them with conventional photolithography methods used in the semiconductor industry. We then describe current advances toward full commercial industrialization of UV-curable NIL (UV-NIL) technology for integrated circuit production. We conclude with brief overviews of some emerging areas of research, from photonics to biotechnology, in which the ability of NIL to fabricate structures of arbitrary geometry is providing new paths for development. As with previous innovations, the increasing availability of tools and techniques from the semiconductor industry is poised to provide a path to bring these innovations from the lab to everyday life.
Display omitted
•Two-Photon lithography can fabricate true 3D microstructures with high spatial resolution.•Feature sizes beyond the diffraction limit can be attained via TPL.•TPL is applicable to ...wide range of materials.•Functionalizing polymers expands the application areas of TPL.•Scalability and high throughput with superior resolution can be achieved in TPL.•TPL is well-suited for the fabrication of three-dimensional metamaterials.
With the advent of femtosecond lasers in the early 1990s, ultrafast laser processing has proven to be an imperative tool for micro/nano machining. Two-photon lithography (TPL) is one such unique microfabrication technique exploiting the nonlinear dependency of the polymerization rate on the irradiating light intensity to produce true three-dimensional structures with feature sizes beyond the diffraction limit. This characteristic has revolutionized laser material processing for the fabrication of micro and nanostructures. In this paper, an overview of TPL including its working principle, experimental setup, and materials is presented. Then, the effect of resolution with a focus on techniques adopted to improve the final resolution of the structures is covered. Insights to improve throughput and speed of fabrication to pave a way for industrialization of this technique are provided. Finally, TPL for microfabrication of structures with the emphasis on metamaterials is thoroughly reviewed and presented.
The development of a simple and cost‐effective method for fabricating ≈10 nm scale nanopatterns over large areas is an important issue, owing to the performance enhancement such patterning brings to ...various applications including sensors, semiconductors, and flexible transparent electrodes. Although nanoimprinting, extreme ultraviolet, electron beams, and scanning probe litho‐graphy are candidates for developing such nanopatterns, they are limited to complicated procedures with low throughput and high startup cost, which are difficult to use in various academic and industry fields. Recently, several easy and cost‐effective lithographic approaches have been reported to produce ≈10 nm scale patterns without defects over large areas. This includes a method of reducing the size using the narrow edge of a pattern, which has been attracting attention for the past several decades. More recently, secondary sputtering lithography using an ion‐bombardment technique was reported as a new method to create high‐resolution and high‐aspect‐ratio structures. Recent progress in simple and cost‐effective top‐down lithography for ≈10 nm scale nanopatterns via edge and secondary sputtering techniques is reviewed. The principles, technical advances, and applications are demonstrated. Finally, the future direction of edge and secondary sputtering lithography research toward issues to be resolved to broaden applications is discussed.
The development of a method for fabricating ≈10 nm‐scale nanopatterns over large areas is an important issue. Edge lithography allows for reduction of the size of patterns through a simple and cost‐effective method. More recently, secondary sputtering lithography using an ion bombardment has been reported as a new method. Research on the methodology of the processes and various applications are reviewed.
PDF
