It is commonly recognized that multiple chip module (MCM) packaging offers great advantages in system performance by virtue of the elimination of an entire level of interconnection. Multilayer thin-film module technologies for high-performance multiple chip packaging were developed and integrated. The technologies, which feature four copper layers, polyimide dielectric, controlled-impedance transmission lines, and solder bump assembly, were demonstrated on a variety of vehicles including, recently, a 4-kbyte RAM module operating at above 100-MHz clock frequency. The generic MCM substrate technology is described. The process can be designed to be compatible with a number of substrate materials as required for specific applications.< >