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  • Si, Xin; Tu, Yung-Ning; Huang, Wei-Hsing; Su, Jian-Wei; Lu, Pei-Jung; Wang, Jing-Hong; Liu, Ta-Wei; Wu, Ssu-Yen; Liu, Ruhui; Chou, Yen-Chi; Zhang, Zhixiao; Sie, Syuan-Hao; Wei, Wei-Chen; Lo, Yun-Chen; Wen, Tai-Hsing; Hsu, Tzu-Hsiang; Chen, Yen-Kai; Shih, William; Lo, Chung-Chuan; Liu, Ren-Shuo; Hsieh, Chih-Cheng; Tang, Kea-Tiong; Lien, Nan-Chun; Shih, Wei-Chiang; He, Yajuan; Li, Qiang; Chang, Meng-Fan

    2020 IEEE International Solid- State Circuits Conference - (ISSCC), 2020-Feb.
    Conference Proceeding

    Advanced AI edge chips require multibit input (IN), weight (W), and output (OUT) for CNN multiply-and-accumulate (MAC) operations to achieve an inference accuracy that is sufficient for practical applications. Computing-in-memory (CIM) is an attractive approach to improve the energy efficiency (EFMAC of MAC operations under a memory-wall constraint. Previous SRAM-CIM macros demonstrated a binary MAC 4, an in-array 8b W-merging with near-memory computing (NMC) using 6T SRAM cells (limited output precision) 5, a 7b1N-1 bW MAC using a 10T SRAM cell (large area) 3, an 4b1N-5bW MAC with a T8T SRAM cell 1, and 8b1N-1bW NMC with 8T SRAM (long MAC latency (TAC)) 2. However, previous works have not achieved high IN/W/OUT precision with fast TAC compact-area, high EFMAC, and robust readout against process variation, due to (1) small sensing margin in word-wise multiple-bit MAC operations, (2) a tradeoff between read accuracy vs. area overhead under process variation, (3) limited EFMAC due to decoupling of software and hardware development.