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  • Effect of Er: YAG laser irr...
    Wei, Diantong; Nakamoto, Ayako; Hiraishi, Noriko; Nakane, Akira; Abuna, Gabriel; Otsuki, Masayuki; Shimada, Yasushi

    Journal of the mechanical behavior of biomedical materials, April 2023, 2023-04-00, 20230401, Letnik: 140
    Journal Article

    To examine the micro tensile bond strength (μTBS) and the resin-dentin interface on a laser-irradiated dentin surface using two different irradiation methods, with or without additional low-energy irradiation. The flat bovine dentin surface was divided into three groups: i). control group (C group, no irradiation), ii) 80 mJ/pulse Er: YAG laser group (80 group), iii) 80 + 30 mJ/pulse Er: YAG laser group (80 + 30 group, with an additional 30 mJ/pulse). After the roughness of the dentin surface was recorded, Clearfil SE Bond 2 or Clearfil Universal Bond Quick (Kuraray Noritake Dental Inc., Tokyo, Japan) was applied. After the μTBS testing, the failure mode was observed. The bonded interface was assessed using Rhodamine-dye incorporated adhesives and observed by optical coherence tomography. The dentin surface showed opened dentinal tubules without a smear layer after irradiation. For both adhesives, the μTBS was significantly higher in 80 + 30 group than in the 80 group (p < 0.05). In the 80 group, the thickness of the adhesive layer was not uniform, and the dentin surface was occasionally in direct contact with the composite resin. The failure mode images showed that most of the fractures in the 80 group were at the sub-surface of irradiated dentin. The adhesive layers of the 80 + 30 groups were homogeneous. The dentin surface was rough and irregular by 80 mJ irradiation, which might result in an inadequate resin-dentin interface and the weak μTBS. The bonded integrity was mitigated by additional irradiation. •The 80 mJ Er:YAG laser treatment decreases the resin-dentin bond strength.•Additional irradiation with a low-power Er:YAG laser of 30 mJ improves the resin-dentin bond strength.•Additional low-power laser irradiation improves the bond strength regardless of 2-step or 1-step self-etching adhesives.