The paper discusses the preparation of multicomponent thin films of Cu-Ti composite with desired elemental composition using the pulsed magnetron co-sputtering technology. The technological goal described in the paper was deposition the Cu-Ti composite with elemental ratio of about 50/50 at%, which is close to the eutectic point from the Cu-Ti alloy system. A large difference in the sputtering yield (about seven-fold) of Cu and Ti metals was challenging, because of the features of used power supplies. Desired concentrations of the Ti and Cu elements were obtained as a result of application of multimagnetron sputtering system, where magnetrons were equipped with the Ti or Cu targets. Additionally, pulse power supply was used together with the pulse width modulation controller. Moreover, the article presents investigations of structural and mechanical properties of deposited Cu, Ti and Cu-Ti films with elemental composition of ca. 50/50 at.%. It was found that the two component Cu0.5Ti0.5 thin films were composed of Cu4Ti3 nanocrystallites built-in an amorphous matrix. As compared to the pure Cu and Ti thin films, the prepared composite exhibited improved hardness and better elasticity reflected in lower values of the Young's modulus. The results of nanoindentation investigations showed that the Cu0.5Ti0.5 composite thin film was characterized by the hardness of 7.59 GPa. •A multi-magnetron co-sputtering system was scaled on the Cu-Ti case study.•The Cu-Ti material were selected due to the large difference in the sputtering yield.•A desired chemical composition of ca. 50/50 at.% of Cu/Ti thin film was obtained.•The Cu0.5Ti0.5 thin films composed from Cu4Ti3 nanocrystallites built in an amorphous matrix.•The Cu0.5Ti0.5 composite, as compared to Cu and Ti thin films, showed improved hardness and better elasticity.