This study designed a resistive film absorber (RFA) with > 90% absorptivity in the 16-27 GHz broadband to reduce electromagnetic radiation in on-board chip architectures. The size of the RFA unit is miniature, which is only 0.1λ L × 0.1λ L × 0.06λ L (where λ L is the lowest operating frequency cutoff wavelength). First, the impedance matching and loss principle of the RFA are analyzed based on the intrinsic parametric method and equivalent circuit theory. This explains the influences of each parameter on absorption performance and verifies that the designed RFA has good polarization insensitivity and angle stability. In addition, the measurements of a prototype RFA were obtained and found to be consistent with simulation results, which proves the feasibility of the RFA. Finally, the RFA was added to a chip architecture to verify its electromagnetic suppression effect with consideration of the influence of temperature on absorption performance. The combined simulation results indicate a significant reduction in the far-field radiation values of the chip architecture, with the maximum electromagnetic radiation suppression effect being 12 dB. These results demonstrate the reliability of the proposed electromagnetic suppression scheme and indicate that the RFA has wide application prospects for radiation suppression in chip systems and electronic packaging.