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Cerreta, E.K.; Escobedo, J.P.; Perez-Bergquist, A.; Koller, D.D.; Trujillo, C.P.; Gray III, G.T.; Brandl, C.; Germann, T.C.
Scripta materialia, 20/May , Letnik: 66, Številka: 9Journal Article
The role of grain boundary type in the early stages of dynamic damage evolution in copper has been investigated. Through a combination of polycrystalline and large-grained specimens, it has been shown that Σ3 and low-angle boundaries are resistant to void nucleation during shock loading to peak compressive stresses between 1.5 and 2.5GPa. It is postulated that these boundaries promote slip transmission or secondary slip activation and thereby relieve the stress concentrations necessary for void nucleation at a boundary.
