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Spremljanje utrjevanja lepila z dielektrično analizo = Dielectric monitoring of adhesive cureŠernek, MilanNamen spremljanja utrjevanja lepila je ugotoviti optimalen čas lepljenja. Utrjevanje lepila je mogoče proučevati z različnimi analitskimi metodami (DSC,DMA, DTA), vendar le v laboratorijskih pogojih, ... težje pa v realnih pogojih pri visoki temperaturi in tlaku med lepljenjem v stiskalnici. Razvitihje nekaj metod za spremljanje utrjevanja lepila v industrijski proizvodnji; najbolj obetajoča je dielektrična analiza, ki je predstavljena v prispevku. Pojasnjen je način merjenja in model za kinetiko utrjevanja lepila.Prikazani so rezultati dielektrične analize pri lepljenju z urea-formaldehidnim lepilom.Source: Les = Wood. - ISSN 0024-1067 (Let. 56, št. 12, 2004, str. 404-408)Type of material - article, component partPublish date - 2004Language - slovenianCOBISS.SI-ID - 1251977
Author
Šernek, Milan
Topics
UF lepilo |
utrjevanje lepila |
dielektrične lastnosti |
stopnja utrjenosti |
UF adhesive |
adhesive cure |
dielectric properties |
degree of cure
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Šernek, Milan | 16382 |
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