Solution-based fabrication of carbon nanotube bumps for flip-chip interconnects

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Solution-based fabrication of carbon nanotube bumps for flip-chip interconnects

Xu, Pingye ...

Source: IEEE transactions on nanotechnology. - ISSN 1536-125X (Vol. 13, no. 6, Nov. 2014, str. 1118-1126)

Type of material - article, component part

Publish date - 2014

Language - english

COBISS.SI-ID - 4636923

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Repository of University of Nova Gorica - RUNG
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Author
Xu, Pingye | Tong, Fei | Davis, Virginia A. | Park, Minseo | Hamilton, Michael

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source: IEEE transactions on nanotechnology. - ISSN 1536-125X (Vol. 13, no. 6, Nov. 2014, str. 1118-1126)

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Year	Impact factor		Edition		Category		Classification
Year	JCR	SNIP	JCR	SNIP	JCR	SNIP	JCR	SNIP

Links to authors' personal bibliographies	Links to information on researchers in the SICRIS system
Xu, Pingye
Tong, Fei	37421
Davis, Virginia A.
Park, Minseo
Hamilton, Michael

Source: Personal bibliographies and: SICRIS

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