VSE knjižnice (vzajemna bibliografsko-kataložna baza podatkov COBIB.SI)
  • Modeling cure of a phenol-formaldehyde adhesive
    Kamke, Frederick A. ...
    The rate and extent of adhesive cure is often the limiting factor controlling press time for the manufacture of wood-based composite products using thermosetting adhesives. In particular, ... phenol-formaldehyde adhesive systems may vary significantly in their rates of cure with only subtle modifications to the formulation. This issue is more critical with thick composites. However, only 10 seconds of press time may mean the difference between a profitable or unprofitable manufacturing process. This paper explores the application of parallel-plate rheometry and in situ measurement of dielectric behavior as a means of predicting adhesive cure. The goal of the research is to identify an acceptable technique to efficiently assess the cure behavior of thermosetting adhesives, derive a kinetic equation, and subsequently predict cure in a simulation model for the hot-pressing process.
    Vir: Proceedings of the Eight Panel Products Symposium
    Vrsta gradiva - prispevek na konferenci
    Leto - 2004
    Jezik - angleški
    COBISS.SI-ID - 1244553

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