Fakulteta za strojništvo, Ljubljana (FSLJ)
  • Processing machine : JP 7098053 B2, 2022-07-08
    Kotar, Matjaž ...
    A processing machine (10) is provided with a laser irradiation device (21) for radiating an annular laser beam, a wire feeding device (31) for feeding a wire from inside the annular laser beam, and a ... control device. When a workpiece irradiation ratio parameter (WIP) expressed by the formula WIP = Pwp/P (where Pwp is the laser beam power introduced onto the workpiece surface when a wire is present in a laser beam irradiation region, and P is the laser beam power introduced onto the workpiece surface when a wire is not present in the laser beam irradiation region) is prescribed, the control device controls the wire feeding device (31) so that a wire end comes in contact with the workpiece surface at the start of additional processing. The control device controls the laser irradiation device (21) so that at the start of additional processing, the initial power P0 of the laser beam is determined on the basis of the WIP, and a laser beam is radiated to the workpiece at the initial power P0.
    Vrsta gradiva - patent ; neleposlovje za odrasle
    Založništvo in izdelava - Chiyada-ku Tokyo : Japan Patent Office, 2022
    Jezik - japonski
    COBISS.SI-ID - 73637379

Dostopna je elektronska verzija dokumenta ali pa gre za elektronski vir
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