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  • Modelling and optimization of a laser droplet-formation process = Modeliranje in optimizacija laserskega tvorjenja kapljice
    Kokalj, Tadej, 1976- ; Grabec, Igor ; Govekar, Edvard
    The laser droplet-formation process (LDFP) is a part of the novel joining technology for forming high-temperature joints. The advantages of this technology are: good heat-input control, good control ... of the added material and limited local heating. A molten metal droplet is used as the basic unit for the filling material, and a determination of the process parameters for the formation of droplets with desired properties is crucial. A physical and numerical model of the process was built to allow a theoretical determination of the process parameters. The numerical model enables a simulation of the process at different sets of parameters and a genetic algorithm optimization was implemented to find the best set. To verify this general procedure for determination and optimization of the parameters, we applied it in a specific case of a nickel wire. On the basis of the numerical model of the process, laser pulses for pendant-droplet formation and droplet detachment were determined and applied in experiments. With numerically determined laser pulses pendant-droplet formation and detachment were accomplished. In most cases, the process showed a very high repeatability. The encouraging experimental verification shows that a numerical approach is a very helpful tool for a determination of the process parameters and a better understanding of the process. It significantly reduces the number of necessary experiments when the laser droplet-formation setup or the target droplet properties are changed.
    Vir: Materiali in tehnologije = Materials and technology. - ISSN 1580-2949 (Letn. 47, št. 4, jul.-avg. 2013, str. 487-495)
    Vrsta gradiva - članek, sestavni del
    Leto - 2013
    Jezik - angleški
    COBISS.SI-ID - 1002154

vir: Materiali in tehnologije = Materials and technology. - ISSN 1580-2949 (Letn. 47, št. 4, jul.-avg. 2013, str. 487-495)

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